公开(公告)号：US20220367330A1

公开(公告)日：2022-11-17

申请号：US17878436

申请日：2022-08-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Fabien QUERCIA

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22

Abstract: A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

公开(公告)号：US20230121780A1

公开(公告)日：2023-04-20

申请号：US18081884

申请日：2022-12-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David AUCHERE ,  Asma HAJJI ,  Fabien QUERCIA ,  Jerome LOPEZ

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US20210320473A1

公开(公告)日：2021-10-14

申请号：US17223649

申请日：2021-04-06

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fabien QUERCIA ,  Jean-Michel RIVIERE

IPC: H01S5/02234 ,  H01L31/0203 ,  H01L31/0232 ,  H01S5/00 ,  H01S5/40 ,  H01S5/0236 ,  G01S7/481

Abstract: An electronic device includes a base substrate having a mounting face. An electronic chip is fastened onto the mounting face of the base substrate. A transparent encapsulation structure is bonded onto the base substrate. The transparent encapsulation structure includes a housing with an internal cavity defining a chamber housing the electronic chip. The encapsulation structure has an external face that supports a light-filtering optical wafer located facing an optical element of the electronic chip. An opaque cover covers the transparent encapsulation structure and includes a local opening facing the light-filtering optical wafer.

公开(公告)号：US20210328403A1

公开(公告)日：2021-10-21

申请号：US17229710

申请日：2021-04-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Fabien QUERCIA ,  Jean-Michel RIVIERE

IPC: H01S5/02345 ,  H01L23/00

Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.

公开(公告)号：US20210242115A1

公开(公告)日：2021-08-05

申请号：US17165295

申请日：2021-02-02

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Fabien QUERCIA

IPC: H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01Q1/22

Abstract: A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

公开(公告)号：US20190148334A1

公开(公告)日：2019-05-16

申请号：US16249122

申请日：2019-01-16

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David AUCHERE ,  Asma HAJJI ,  Fabien QUERCIA ,  Jerome LOPEZ

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/552

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US20250070081A1

公开(公告)日：2025-02-27

申请号：US18947819

申请日：2024-11-14

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David AUCHERE ,  Asma HAJJI ,  Fabien QUERCIA ,  Jerome LOPEZ

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/552

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US20240146019A1

公开(公告)日：2024-05-02

申请号：US18408149

申请日：2024-01-09

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Fabien QUERCIA ,  Jean-Michel RIVIERE

IPC: H01S5/02345 ,  H01L23/00

CPC classification number: H01S5/02345 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12042 ,  H01L2924/18165

Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.

公开(公告)号：US20230059627A1

公开(公告)日：2023-02-23

申请号：US17885201

申请日：2022-08-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Justin CATANIA ,  Michel GARNIER ,  Fabien QUERCIA

IPC: H01L23/13 ,  H05K1/18 ,  H05K3/34 ,  H05K3/30

Abstract: The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).

公开(公告)号：US20200305283A1

公开(公告)日：2020-09-24

申请号：US16815554

申请日：2020-03-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fabien QUERCIA ,  David AUCHERE ,  Norbert CHEVRIER ,  Fabien CORSAT

IPC: H05K1/18 ,  H05K3/34

Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.