公开(公告)号：US20210066554A1

公开(公告)日：2021-03-04

申请号：US17006128

申请日：2020-08-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L33/52 ,  H01L33/44 ,  H01L33/62 ,  H01L31/0216 ,  H01L31/0203

Abstract: An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.

公开(公告)号：US20220102591A1

公开(公告)日：2022-03-31

申请号：US17485010

申请日：2021-09-24

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Olivier ZANELLATO ,  Remi BRECHIGNAC ,  Jerome LOPEZ

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00

Abstract: The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

公开(公告)号：US20210066271A1

公开(公告)日：2021-03-04

申请号：US17006092

申请日：2020-08-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L25/16 ,  H01L33/62 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/52

Abstract: An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.

公开(公告)号：US20240072214A1

公开(公告)日：2024-02-29

申请号：US18503025

申请日：2023-11-06

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Olivier ZANELLATO ,  Remi BRECHIGNAC ,  Jerome LOPEZ

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00

CPC classification number: H01L33/483 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005

Abstract: The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

公开(公告)号：US20210135038A1

公开(公告)日：2021-05-06

申请号：US17071694

申请日：2020-10-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L31/16 ,  H01L23/00

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

公开(公告)号：US20230034445A1

公开(公告)日：2023-02-02

申请号：US17965443

申请日：2022-10-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L33/52 ,  H01L31/0203 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/62

Abstract: An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.

公开(公告)号：US20220310869A1

公开(公告)日：2022-09-29

申请号：US17838929

申请日：2022-06-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L31/16 ,  H01L23/00

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

公开(公告)号：US20210135069A1

公开(公告)日：2021-05-06

申请号：US17071603

申请日：2020-10-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L33/54 ,  H01L33/00

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.