Indexing of electronic devices distributed on different chips

    公开(公告)号:US10109590B2

    公开(公告)日:2018-10-23

    申请号:US14750466

    申请日:2015-06-25

    Abstract: A method for indexing electronic devices includes: forming first chips in a first wafer, forming second chips in a second wafer, forming the electronic devices by coupling each first chip with a corresponding second chip, and forming an index on each electronic device. The index is indicative of a position of the corresponding first chip in the first wafer. The step of forming an index includes forming a first portion of the index on the first chip, and forming a second portion of the index on the second chip.

    Scintillator radiation detector and corresponding dosimeter

    公开(公告)号:US11977190B2

    公开(公告)日:2024-05-07

    申请号:US16917517

    申请日:2020-06-30

    CPC classification number: G01T1/20184 G01T1/023 G01T1/2002 G01T1/20187

    Abstract: A device such as a dosimeter for detecting ionizing radiation, for example, X-ray radiation, in hospitals or the like. The device includes scintillator material configured to produce light as a result of radiation interacting with the scintillator material, and photoelectric conversion circuitry optically coupled to the scintillator material and configured to produce electrical signals via photoelectric conversion of light produced by the scintillator material. The device includes a plurality of photoelectric converters optically coupled with the scintillator material at spatially separated locations. The plurality of photoelectric converters thus produce respective electrical signals by photoelectric conversion of light produced by the scintillator material as a result of radiation interacting with the scintillator material. Improved energy linearity is thus facilitated while providing more efficient detection over the whole energy spectrum of radiation detected.

    INDEXING OF ELECTRONIC DEVICES DISTRIBUTED ON DIFFERENT CHIPS
    3.
    发明申请
    INDEXING OF ELECTRONIC DEVICES DISTRIBUTED ON DIFFERENT CHIPS 审中-公开
    电子设备分布在不同的插座上的指标

    公开(公告)号:US20150294942A1

    公开(公告)日:2015-10-15

    申请号:US14750466

    申请日:2015-06-25

    Abstract: A method for indexing electronic devices includes: forming first chips in a first wafer, forming second chips in a second wafer, forming the electronic devices by coupling each first chip with a corresponding second chip, and forming an index on each electronic device. The index is indicative of a position of the corresponding first chip in the first wafer. The step of forming an index includes forming a first portion of the index on the first chip, and forming a second portion of the index on the second chip.

    Abstract translation: 一种用于索引电子设备的方法包括:在第一晶片中形成第一芯片,在第二晶片中形成第二芯片,通过将每个第一芯片与相应的第二芯片耦合形成电子器件,并在每个电子器件上形成指数。 索引表示第一晶片中对应的第一芯片的位置。 形成索引的步骤包括在第一芯片上形成索引的第一部分,并在第二芯片上形成索引的第二部分。

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