公开(公告)号：US20170315175A1

公开(公告)日：2017-11-02

申请号：US15221211

申请日：2016-07-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Nicolas Bernard GROSSIER ,  Lorenzo GUERRIERI ,  Giuseppe Livio GOBBATO ,  Daniele ZERBINI ,  Martina CORDONI ,  Pasqualina Fragneto

IPC: G01R31/317 ,  G01R31/3177

CPC classification number: G01R31/31713 ,  G01R31/28 ,  G01R31/3177 ,  G06F1/26 ,  G06F11/24 ,  G06F11/3024 ,  G06F11/3062 ,  G06F11/3636 ,  G06F11/364 ,  G06F11/3648 ,  G06F11/3656 ,  H02J13/0089 ,  H02J13/0093 ,  H02J13/0096 ,  H04B3/54 ,  H04B3/542 ,  H04B2203/5495 ,  H05B37/0263

Abstract: A semiconductor device, for example an integrated circuit such as a microcontroller (MCU) or a digital signal processor (DSP), includes a semiconductor die coupled with a power supply line, a debug module coupled with the semiconductor die to exchange semiconductor die debug command and data signals with the semiconductor die, and a modem coupled with the power supply line. The debug module is arranged to convey the semiconductor die debug command and data signals over the power supply line.