公开(公告)号：US20180053709A1

公开(公告)日：2018-02-22

申请号：US15474814

申请日：2017-03-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Paolo Crema ,  Paolo Casati

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49582 ,  H01L21/4853 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/09 ,  H01L24/43 ,  H01L24/45 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/08058 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85385 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Semiconductor devices comprising at least one electrically conductive metal element in a non-conductive package material are manufactured by: providing a first metal layer having a smooth morphology for covering the aforesaid metal element; and providing a second metal layer for covering partially the first layer, leaving at least one portion of the surface of the first layer exposed, the second layer having a rough morphology. There may moreover be provided a die pad for mounting a semiconductor die by providing the aforesaid first layer for covering the die pad and attaching a semiconductor die on the die pad in contact with said first layer.