公开(公告)号：US20170369309A1

公开(公告)日：2017-12-28

申请号：US15379091

申请日：2016-12-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Laura OGGIONI ,  Matteo GARAVAGLIA ,  Roberto SOMASCHINI

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00269 ,  B81B3/0097 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2203/0315 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/037

Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.