公开(公告)号：US20240162175A1

公开(公告)日：2024-05-16

申请号：US18054806

申请日：2022-11-11

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Lucrezia GUARINO ,  Francesca MILANESI ,  Claudio ZAFFERONI

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/0225 ,  H01L2224/0233 ,  H01L2224/03001 ,  H01L2224/0401 ,  H01L2224/04042

Abstract: The present disclosure is directed to embodiments of a conductive structure on a conductive barrier layer that separates the conductive structure from a conductive layer on which the conductive barrier layer is present. A gap or crevice extends along respective surfaces of the conductive structure and along respective surfaces of one or more insulating layers. The gap or crevice separates the respective surfaces of the one or more insulating layers from the respective surfaces of the conductive structure. The gap or crevice provides clearance in which the conductive structure may expand into when exposed to changes in temperature. For example, when coupling a wire bond to the conductive structure, the conductive structure may increase in temperature and expand into the gap or crevice. However, even in the expanded state, respective surfaces of the conductive structure do not physically contact the respective surfaces of the one or more insulating layers.