公开(公告)号：US08524531B2

公开(公告)日：2013-09-03

申请号：US13671669

申请日：2012-11-08

Applicant: STMicroelectronics, Inc.

Inventor： Anthony M. Chiu ,  Tong Yan Tee

IPC: H01L21/00

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract translation: 提高了集成电路封装中的焊接可靠性。 四边形，平坦的，非引线的集成电路封装的每个端子形成有在端子的底表面中限定焊料槽的部分。 集成电路封装的管芯焊盘的外表面也形成有在管芯焊盘的周边上限定多个焊料槽的部分。 当焊料施加到管芯焊盘和端子时，填充焊料槽的焊料增加了集成电路封装的焊点可靠性。

公开(公告)号：US20130130492A1

公开(公告)日：2013-05-23

申请号：US13671669

申请日：2012-11-08

Applicant: STMicroelectronics, Inc.

Inventor： Anthony M. Chiu ,  Tong Yan Tee

IPC: H01L21/48

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract translation: 提高了集成电路封装中的焊接可靠性。 四边形，平坦的，非引线的集成电路封装的每个端子形成有在端子的底表面中限定焊料槽的部分。 集成电路封装的管芯焊盘的外表面也形成有在管芯焊盘的周边上限定多个焊料槽的部分。 当焊料施加到管芯焊盘和端子时，填充焊料槽的焊料增加了集成电路封装的焊点可靠性。