公开(公告)号：US08785297B2

公开(公告)日：2014-07-22

申请号：US13649797

申请日：2012-10-11

Applicant: STMicroelectronics (Tours) SAS

Inventor： Marc Feron ,  Vincent Jarry ,  Laurent Barreau

IPC: H01L21/30

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01087

Abstract: A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips.

Abstract translation: 一种封装电子部件的方法，包括以下步骤：在半导体晶片的第一表面中形成电子部件; 在第一表面上形成包括由绝缘材料分隔开的导电轨道和通孔的互连堆叠; 在互连堆叠上形成第一和第二接合焊盘; 至少在轮廓上除外，使晶片变薄; 用第一树脂层填充薄的区域; 在所述第一接合焊盘上布置至少一个第一芯片，并在所述第二焊盘上形成焊料凸块; 沉积覆盖第一芯片并部分覆盖焊料凸块的第二树脂层; 将粘合带粘合在第一树脂层上; 并将结构划分成单个芯片。