公开(公告)号：US20240345229A1

公开(公告)日：2024-10-17

申请号：US18133299

申请日：2023-04-11

Applicant: STMicroelectronics International N.V.

Inventor： Colin CAMPBELL ,  Marco ANTONELLI ,  Calum RITCHIE ,  Bhagya Prakash BANDUSENA

IPC: G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/173

CPC classification number: G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/173

Abstract: A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.

公开(公告)号：US20250125279A1

公开(公告)日：2025-04-17

申请号：US18485523

申请日：2023-10-12

Applicant: STMicroelectronics International N.V.

Inventor： Kai Quan CHENG ,  Tat Ming TEO ,  Andrew John PRICE ,  William HALLIDAY ,  Bhagya Prakash BANDUSENA ,  Calum RITCHIE

IPC: H01L23/552 ,  H01L23/00

Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.