公开(公告)号：US20240345229A1

公开(公告)日：2024-10-17

申请号：US18133299

申请日：2023-04-11

Applicant: STMicroelectronics International N.V.

Inventor： Colin CAMPBELL ,  Marco ANTONELLI ,  Calum RITCHIE ,  Bhagya Prakash BANDUSENA

IPC: G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/173

CPC classification number: G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/173

Abstract: A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.