公开(公告)号：US20240288680A1

公开(公告)日：2024-08-29

申请号：US18584533

申请日：2024-02-22

Applicant: STMicroelectronics International N.V.

Inventor： Roberto CARMINATI ,  Tarek AFIFI AFIFI ,  Carlo Luigi PRELINI ,  Sonia COSTANTINI

IPC: G02B26/08 ,  G01B7/16 ,  G02B26/10

CPC classification number: G02B26/0833 ,  G01B7/22 ,  G02B26/101

Abstract: A MEMS device includes a semiconductor body with a fixed structure defining a cavity, and a deformable main body suspended on the cavity. A piezoelectric actuator is on the deformable main body, and a piezoelectric sensor element is on the deformable main body, which forms with the deformable main body a strain sensor. The piezoelectric sensor element includes a detection piezoelectric region of aluminum nitride on the deformable main body, and an intermediate detection electrode on the detection piezoelectric region. The deformable main body, the detection piezoelectric region, and the intermediate detection electrode form a first detection capacitor of the strain sensor. The deformable main body, the piezoelectric actuator, and the piezoelectric sensor element form a deformable structure suspended on the cavity and deformable by the piezoelectric actuator, with the strain sensor allowing the deformation of the deformable structure to be detected.

公开(公告)号：US20240315671A1

公开(公告)日：2024-09-26

申请号：US18123602

申请日：2023-03-20

Applicant: STMicroelectronics International N.V.

Inventor： Federico VERCESI ,  Giorgio ALLEGATO ,  Tarek AFIFI AFIFI ,  Sonia COSTANTINI

IPC: A61B8/00 ,  A61B8/08

CPC classification number: A61B8/4483 ,  A61B8/52

Abstract: A PMUT includes a substrate being doped and having a plurality of conductive vias formed therein, each conductive via formed of a portion of the substrate extending completely from a back side of the substrate to a front side of the substrate and being encircled by an isolating structure that electrically isolates that portion of the substrate from other portions of the substrate. An insulating layer stacked on the front side of the substrate and has through-holes therein over the plurality of conductive vias. An interconnection layer is stacked on the insulating layer and is connected to the plurality of conductive vias. A membrane carried is by the interconnection layer and underlying substrate, the membrane being shaped so as to delimit a chamber. A piezoelectric stack formed on the membrane over the chamber and vibrates the membrane in response to application of an alternating voltage to the piezoelectric stack.