HIGH DENSITY PMUT ARRAY ARCHITECTURE FOR ULTRASOUND IMAGING

    公开(公告)号:US20240315671A1

    公开(公告)日:2024-09-26

    申请号:US18123602

    申请日:2023-03-20

    CPC classification number: A61B8/4483 A61B8/52

    Abstract: A PMUT includes a substrate being doped and having a plurality of conductive vias formed therein, each conductive via formed of a portion of the substrate extending completely from a back side of the substrate to a front side of the substrate and being encircled by an isolating structure that electrically isolates that portion of the substrate from other portions of the substrate. An insulating layer stacked on the front side of the substrate and has through-holes therein over the plurality of conductive vias. An interconnection layer is stacked on the insulating layer and is connected to the plurality of conductive vias. A membrane carried is by the interconnection layer and underlying substrate, the membrane being shaped so as to delimit a chamber. A piezoelectric stack formed on the membrane over the chamber and vibrates the membrane in response to application of an alternating voltage to the piezoelectric stack.

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