公开(公告)号：US20240332328A1

公开(公告)日：2024-10-03

申请号：US18607215

申请日：2024-03-15

Applicant: STMicroelectronics International N.V.

Inventor： Hui-Tzu WANG ,  David GANI ,  Yiying KUO

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14623 ,  H01L24/13 ,  H01L24/14 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/14051 ,  H01L2224/14183

Abstract: The present disclosure is directed to an optical sensor package with light shielding material covering five sides. The optical sensor package includes a transparent layer, a substrate layer, sensor elements between the transparent layer and the substrate layer, a solder mask on the side of the substrate layer opposite the transparent layer, and layer of molding material covering five sides of the optical sensor package. The solder mask and layer of molding material prevent light from entering the sides of the optical sensor package or from traveling through the substrate layer and reflecting toward the sensor elements.

公开(公告)号：US20240332436A1

公开(公告)日：2024-10-03

申请号：US18607211

申请日：2024-03-15

Applicant: STMicroelectronics International N.V.

Inventor： Yiying KUO ,  David GANI ,  Hui-Tzu WANG

IPC: H01L31/0216 ,  H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02164 ,  H01L31/02005 ,  H01L31/0203

Abstract: The present disclosure is directed to an optical sensor package with light shielding material covering five sides. The optical sensor package includes a transparent layer, a substrate layer, sensor elements between the transparent layer and the substrate layer, a first layer of light shielding material on the side of the substrate layer opposite the transparent layer, and a second layer of light shielding material covering five sides of the optical sensor package. The first and second layers of light shielding material prevent light from entering the sides of the optical sensor package or from traveling through the substrate layer and reflecting toward the sensor elements.