公开(公告)号：US20040217359A1

公开(公告)日：2004-11-04

申请号：US10786878

申请日：2004-02-25

Applicant: STMicroelectronics Ltd

Inventor： Jeffrey Raynor

IPC: H01L027/15

CPC classification number: H01L27/1443 ,  H01L27/14609

Abstract: A CMOS image sensing structure includes a photodiode, in which an epitaxial layer is on a P-type substrate. The photodiode includes an N-well collection node in the epitaxial layer. An isolation trench is provided around the collection node to provide better control of the width of the collection node. The collection node can be surrounded by P-wells or by epitaxial material. It can also be surrounded by epitaxial material with the isolation trench being outwardly extended to ensure compliance with existing design rules.

Abstract translation: CMOS图像感测结构包括其中外延层在P型衬底上的光电二极管。 光电二极管包括外延层中的N阱收集节点。 在收集节点周围设置隔离沟槽，以便更好地控制收集节点的宽度。 采集节点可以被P阱或外延材料包围。 它也可以被外延材料包围，隔离槽向外延伸以确保符合现有的设计规则。

公开(公告)号：US20020114025A1

公开(公告)日：2002-08-22

申请号：US09993387

申请日：2001-11-16

Applicant: STMicroelectronics Ltd

Inventor： Jeffrey Raynor ,  Peter Denyer ,  Jonathan Ephriam David Hurwitz

IPC: H04N001/46

CPC classification number: H04N5/37452 ,  H04N5/353 ,  H04N5/3575 ,  H04N5/378

Abstract: An image plane includes a plurality of pixels. Each pixel comprises a photodiode and two transistors, and each pixel is connected by a signal bus to a respective storage node located off the image plane. Each storage node comprises two capacitors and associated switches. One of the transistors applies a reset pulse to the pixel, and the other transistor connects the pixel to a given conductor of the signal bus, which is then connected to the storage node. The pixel transistors can be operated simultaneously, and the sensed values can subsequently be transferred from the storage nodes sequentially.

Abstract translation: 图像平面包括多个像素。 每个像素包括光电二极管和两个晶体管，并且每个像素通过信号总线连接到位于图像平面外的相应存储节点。 每个存储节点包括两个电容器和相关联的开关。 其中一个晶体管将复位脉冲施加到像素，另一个晶体管将像素连接到信号总线的给定导体，该导体然后连接到存储节点。 像素晶体管可以同时操作，并且随后可以从存储节点依次传送感测值。

公开(公告)号：US20040227068A1

公开(公告)日：2004-11-18

申请号：US10677850

申请日：2003-10-02

Applicant: STMicroelectronics Ltd.

Inventor： Jeffrey Raynor ,  Jean-Luc Jaffard

IPC: H01L027/00 ,  H01J005/02

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L31/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for attaching a sensor and a housing to opposite sides of a mounting substrate is provided. The sensor has a sensing face that includes a sensing area and at least one signal output contact thereon. The mounting substrate has a circuitry face and at least one signal input contact thereon. The mounting substrate also has an opening therethrough. The method includes positioning the sensing area over the opening so that the at least one signal output contact of the sensor makes contact with the at least one signal input contact of the mounting substrate. The mounting substrate receives the housing so that the housing and the sensor are in alignment.

Abstract translation: 提供了一种用于将传感器和壳体附接到安装基板的相对侧的方法。 传感器具有感测面，其包括感测区域和其上的至少一个信号输出接触。 安装基板具有电路面和其上的至少一个信号输入触点。 安装基板也具有穿过其中的开口。 该方法包括将感测区域定位在开口上，使得传感器的至少一个信号输出触点与安装基板的至少一个信号输入触点接触。 安装基板接收壳体，使得壳体和传感器对准。