Back-side illuminated image sensor with a junction insulation
    1.
    发明授权
    Back-side illuminated image sensor with a junction insulation 有权
    具有结合绝缘的背面照明图像传感器

    公开(公告)号:US08963273B2

    公开(公告)日:2015-02-24

    申请号:US14247084

    申请日:2014-04-07

    Abstract: A method for forming a back-side illuminated image sensor, including the steps of: a) forming, from the front surface, doped polysilicon regions, of a conductivity type opposite to that of the substrate, extending in depth orthogonally to the front surface and emerging into the first layer; b) thinning the substrate from its rear surface to reach the polysilicon regions, while keeping a strip of the first layer; c) depositing, on the rear surface of the thinned substrate, a doped amorphous silicon layer, of a conductivity type opposite to that of the substrate; and d) annealing at a temperature capable of transforming the amorphous silicon layer into a crystallized layer.

    Abstract translation: 一种用于形成背面照明图像传感器的方法,包括以下步骤:a)从前表面形成与衬底相反的导电类型的掺杂多晶硅区域,其垂直于正面延伸, 进入第一层; b)使衬底从其后表面变薄到达多晶硅区域,同时保持第一层的条带; c)在所述薄化衬底的后表面上沉积与所述衬底相反的导电类型的掺杂非晶硅层; 和d)在能够将非晶硅层转变成结晶层的温度下退火。

    BACK-SIDE ILLUMINATED IMAGE SENSOR WITH A JUNCTION INSULATION
    2.
    发明申请
    BACK-SIDE ILLUMINATED IMAGE SENSOR WITH A JUNCTION INSULATION 有权
    具有连接绝缘的背面照明图像传感器

    公开(公告)号:US20140217541A1

    公开(公告)日:2014-08-07

    申请号:US14247084

    申请日:2014-04-07

    Abstract: A method for forming a back-side illuminated image sensor, including the steps of: a) forming, from the front surface, doped polysilicon regions, of a conductivity type opposite to that of the substrate, extending in depth orthogonally to the front surface and emerging into the first layer; b) thinning the substrate from its rear surface to reach the polysilicon regions, while keeping a strip of the first layer; c) depositing, on the rear surface of the thinned substrate, a doped amorphous silicon layer, of a conductivity type opposite to that of the substrate; and d) annealing at a temperature capable of transforming the amorphous silicon layer into a crystallized layer.

    Abstract translation: 一种用于形成背面照明图像传感器的方法,包括以下步骤:a)从前表面形成与衬底相反的导电类型的掺杂多晶硅区域,其垂直于正面延伸, 进入第一层; b)使衬底从其后表面变薄到达多晶硅区域,同时保持第一层的条带; c)在所述薄化衬底的后表面上沉积与所述衬底相反的导电类型的掺杂非晶硅层; 和d)在能够将非晶硅层转变成结晶层的温度下退火。

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