公开(公告)号：US20140291781A1

公开(公告)日：2014-10-02

申请号：US14224861

申请日：2014-03-25

Applicant: STMicroelectronics S.r.I.

Inventor： Mark Andrew Shaw ,  Fabrizio Soglio

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0032 ,  B81C1/00261 ,  H01L29/84 ,  H04R19/005 ,  H04R19/02 ,  H04R31/00

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract translation: 一种封装的MEMS换能器装置，包括：模具，包括：半导体本体，其具有在第一方向上彼此相对的前侧和后侧，至少一个在前侧和后侧之间延伸穿过半导体本体的空腔 并且至少一个膜在前侧延伸至少部分地悬挂在空腔上; 以及设计成在其内表面上容纳模具的包装。 换能器装置还包括在半导体本体的后侧延伸的密封层，用于密封空腔，并且包括在密封层和封装的内表面之间延伸的糊层，用于将管芯牢固地连接到封装。