公开(公告)号：US20150001651A1

公开(公告)日：2015-01-01

申请号：US14316504

申请日：2014-06-26

Applicant: STMicroelectronics S.r.I.

Inventor： Dino Faralli ,  Paolo Ferrari ,  Laura Maria Castoldi

IPC: B81B3/00 ,  B81C1/00 ,  B81C3/00

CPC classification number: B81B3/0021 ,  B81B7/0016 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/115 ,  B81C1/00158 ,  B81C3/00 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface. A cap is fixed to the first face of the die and has a hole forming a fluidic path connecting the diaphragm with the outside world. A closing region, for example a support, a second cap, or another die, is fixed to the second face of the die. The closing region forms, together with the die and the cap, a stop structure configured to limit movements of the suspended region in a direction perpendicular to the first face.

Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成隔膜，并且面对第一表面。 帽固定在模具的第一面上，并且具有形成连接隔膜与外界的流体路径的孔。 关闭区域，例如支撑件，第二盖子或另一个模具，被固定到模具的第二面。 闭合区域与模具和盖一起形成止挡结构，其被构造成限制悬挂区域在垂直于第一面的方向上的移动。

公开(公告)号：US09233834B2

公开(公告)日：2016-01-12

申请号：US14316504

申请日：2014-06-26

Applicant: STMicroelectronics S.r.I.

Inventor： Dino Faralli ,  Paolo Ferrari ,  Laura Maria Castoldi

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C3/00

CPC classification number: B81B3/0021 ,  B81B7/0016 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/115 ,  B81C1/00158 ,  B81C3/00 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface. A cap is fixed to the first face of the die and has a hole forming a fluidic path connecting the diaphragm with the outside world. A closing region, for example a support, a second cap, or another die, is fixed to the second face of the die. The closing region forms, together with the die and the cap, a stop structure configured to limit movements of the suspended region in a direction perpendicular to the first face.

Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成隔膜，并且面对第一表面。 帽固定在模具的第一面上，并且具有形成连接隔膜与外界的流体路径的孔。 关闭区域，例如支撑件，第二盖子或另一个模具，被固定到模具的第二面。 闭合区域与模具和盖一起形成止挡结构，其被构造成限制悬挂区域在垂直于第一面的方向上的移动。

公开(公告)号：US20150001645A1

公开(公告)日：2015-01-01

申请号：US14316583

申请日：2014-06-26

Applicant: STMicroelectronics S.r.I. ,  STMicroelectronics International N.V.

Inventor： Dino Faralli ,  Benedetto Vigna ,  Laura Maria Castoldi

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.

Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。