-
1.发明申请公开(公告)号：US20150001645A1
公开(公告)日：2015-01-01
申请号：US14316583
申请日：2014-06-26
CPC分类号： B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81C1/00269 , B81C2203/0118 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.
摘要翻译： 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。
-
2.发明申请ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS 审中-公开具有改进电阻的MEMS环境传感器装置的组装以及相应的制造工艺公开(公告)号：US20150014798A1
公开(公告)日：2015-01-15
申请号：US14327272
申请日：2014-07-09
CPC分类号： B81B3/00 , B81B7/0058 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81C1/00 , B81C2203/0109 , G01F1/00 , G01H17/00 , G01K1/00 , G01L1/00 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/00012
摘要： Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.
摘要翻译： 这里描述的是一种用于MEMS传感器装置的组件，其设想：由半导体材料制成的第一主体，在其第一主面处集成微机械检测结构; 设置在第一主体的第一主面上的盖元件，位于微机械检测结构的上方; 以及设置在第一主体和盖元件之间的粘合结构，在对应于微机械检测结构的位置中限定间隙。 通过与间隙流体连通的粘合结构限定至少一个第一开口。
-
3.发明授权公开(公告)号：US09321628B2
公开(公告)日：2016-04-26
申请号：US14316583
申请日：2014-06-26
CPC分类号： B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81C1/00269 , B81C2203/0118 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.
摘要翻译： 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。
-
4.发明申请公开(公告)号：US20150001651A1
公开(公告)日：2015-01-01
申请号：US14316504
申请日：2014-06-26
CPC分类号： B81B3/0021 , B81B7/0016 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81B2207/115 , B81C1/00158 , B81C3/00 , B81C2203/0118 , H01L2224/48091 , H01L2224/48145 , H01L2924/00014 , H01L2924/00012
摘要： A MEMS device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface. A cap is fixed to the first face of the die and has a hole forming a fluidic path connecting the diaphragm with the outside world. A closing region, for example a support, a second cap, or another die, is fixed to the second face of the die. The closing region forms, together with the die and the cap, a stop structure configured to limit movements of the suspended region in a direction perpendicular to the first face.
摘要翻译： 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成隔膜，并且面对第一表面。 帽固定在模具的第一面上，并且具有形成连接隔膜与外界的流体路径的孔。 关闭区域，例如支撑件，第二盖子或另一个模具，被固定到模具的第二面。 闭合区域与模具和盖一起形成止挡结构，其被构造成限制悬挂区域在垂直于第一面的方向上的移动。
-
5.发明申请ELECTRONIC DEVICE WITH INTEGRATED TEMPERATURE SENSOR AND MANUFACTURING METHOD THEREOF 有权具有集成温度传感器的电子设备及其制造方法公开(公告)号：US20140369386A1
公开(公告)日：2014-12-18
申请号：US14308470
申请日：2014-06-18
IPC分类号： G01K7/02
CPC分类号： B01L3/502715 , B01L3/502707 , B01L2300/0627 , B01L2300/0848 , B01L2300/12 , G01F1/6845 , G01F1/6888 , G01K7/02 , G01K7/021 , H01L35/32 , H01L35/325 , Y10T29/41
摘要： A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
摘要翻译： 一种微流体传感器，包括：半导体本体，具有沿一个方向彼此相对的第一和第二侧; 埋入通道，在半导体本体内延伸; 电介质或绝缘材料的结构层，形成在所述半导体本体的至少部分地悬挂在所述掩埋沟道上方的所述第一侧上; 以及与第一导电材料不同的第一导电材料的第一导电材料和第二条带的第一热电偶元件，第一导电材料和第二条带电连接到第一条带。 第一热电偶元件被埋在结构层中，并且在第一位置处部分地延伸穿过掩埋通道。 公开了相应的制造方法。
-
6.发明授权公开(公告)号：US09233834B2
公开(公告)日：2016-01-12
申请号：US14316504
申请日：2014-06-26
CPC分类号： B81B3/0021 , B81B7/0016 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81B2207/115 , B81C1/00158 , B81C3/00 , B81C2203/0118 , H01L2224/48091 , H01L2224/48145 , H01L2924/00014 , H01L2924/00012
摘要： A MEMS device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface. A cap is fixed to the first face of the die and has a hole forming a fluidic path connecting the diaphragm with the outside world. A closing region, for example a support, a second cap, or another die, is fixed to the second face of the die. The closing region forms, together with the die and the cap, a stop structure configured to limit movements of the suspended region in a direction perpendicular to the first face.
摘要翻译： 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成隔膜，并且面对第一表面。 帽固定在模具的第一面上，并且具有形成连接隔膜与外界的流体路径的孔。 关闭区域，例如支撑件，第二盖子或另一个模具，被固定到模具的第二面。 闭合区域与模具和盖一起形成止挡结构，其被构造成限制悬挂区域在垂直于第一面的方向上的移动。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.036 秒)
