公开(公告)号：US20030209783A1

公开(公告)日：2003-11-13

申请号：US10369114

申请日：2003-02-18

Applicant: STMicroelectronics S.r.I.

Inventor： Paolo Casati ,  Amedeo Maierna ,  Bruno Murari

IPC: H01L023/552

CPC classification number: H01L23/49568 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/552 ,  H01L2224/83855 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025

Abstract: An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

Abstract translation: 一种用于电子集成电力电路的组装结构，该电路制造在具有与所述集成电路相关联的多个接触焊盘并且电连接到所述结构的相应引线的半导体管芯上，其中屏蔽元件通过 一层粘合剂材料。