公开(公告)号：US11915989B2

公开(公告)日：2024-02-27

申请号：US17573339

申请日：2022-01-11

申请人： STMicroelectronics S.r.l.

发明人： Giovanni Graziosi ,  Aurora Sanna ,  Riccardo Villa

IPC分类号： H01L23/31 ,  H01Q1/22 ,  H01L23/538 ,  H01L23/66

CPC分类号： H01L23/3114 ,  H01L23/5389 ,  H01L23/66 ,  H01Q1/2283 ,  H01L2223/6677

摘要： An antenna-in-package semiconductor device includes a semiconductor chip coupled to a planar substrate. An encapsulation body encapsulates the semiconductor chip. The encapsulation body includes a through cavity extending to the planar substrate. A rectilinear wire antenna is mounted within the through cavity and extends, for instance from the planar substrate, along an axis that is transverse to a surface of the planar substrate to which the semiconductor chip is coupled. The rectilinear wire antenna is electrically coupled to the semiconductor chip. An insulating material fills the cavity to encapsulated the rectilinear wire antenna.

公开(公告)号：US11990442B2

公开(公告)日：2024-05-21

申请号：US17537112

申请日：2021-11-29

申请人： STMicroelectronics S.r.l.

发明人： Cristina Somma ,  Aurora Sanna ,  Damian Halicki

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2924/30101

摘要： A semiconductor die is mounted at a die area of a ball grid array package that includes an array of electrically-conductive ball. A power channel conveys a power supply current to the semiconductor die. The power channel is formed by an electrically-conductive connection plane layers extending in a longitudinal direction between a distal end at a periphery of the package and a proximal end at the die area. A distribution of said electrically-conductive balls is made along the longitudinal direction. The electrically-conductive connection plane layer includes subsequent portions in the longitudinal direction between adjacent electrically-conductive balls of the distribution. Respective electrical resistance values of the subsequent portions monotonously decrease from the distal end to the proximal end. A uniform distribution of power supply current over the length of the power channel is thus facilitated.

公开(公告)号：US11764134B2

公开(公告)日：2023-09-19

申请号：US16745043

申请日：2020-01-16

申请人： STMicroelectronics S.r.l.

发明人： Alberto Arrigoni ,  Giovanni Graziosi ,  Aurora Sanna

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H01L23/49589 ,  H01L21/4825 ,  H01L23/4952 ,  H01L23/49503

摘要： A semiconductor chip is mounted to a chip mounting portion of a leadframe which further includes and one or more leads in the leadframe arranged facing the chip mounting portion. The lead lies in a first plane and the chip mounting portion lies in a second plane, the first plane and the second plane mutually offset with a gap therebetween. An electrical component (such as a capacitor) is arranged on the chip mounting portion and extends vertically between the first plane and the second plane.