公开(公告)号：US12255595B2

公开(公告)日：2025-03-18

申请号：US17371368

申请日：2021-07-09

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd.

Inventor： Marco Sautto ,  Giona Fucili ,  Valerio Lo Muzzo ,  Kaufik Linggajaya

IPC: H01L41/02 ,  H03H11/04 ,  H10N30/30

Abstract: In accordance with an embodiment, a method of operating a piezoelectric transducer configured to transduce mechanical vibrations into transduced electrical signals at a pair of sensor electrodes includes stimulating a resonant oscillation of the piezoelectric transducer by applying at least one pulse electrical stimulation signal to the pair of sensor electrodes; detecting, at the pair of sensor electrodes, at least one electrical signal resulting from the stimulated resonant oscillation, wherein the at least one electrical signal resulting from the stimulated resonant oscillation oscillates at a resonance frequency of the piezoelectric transducer; measuring a frequency of oscillation of the at least one electrical signal resulting from the stimulated resonant oscillation to obtain a measured resonance frequency of the piezoelectric transducer; and tuning a stopband frequency of a notch filter coupled to the piezoelectric transducer to match the measured resonance frequency of the piezoelectric transducer.

公开(公告)号：US20220021373A1

公开(公告)日：2022-01-20

申请号：US17371368

申请日：2021-07-09

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd.

Inventor： Marco Sautto ,  Giona Fucili ,  Valerio Lo Muzzo ,  Kaufik Linggajaya

IPC: H03H11/04 ,  H01L41/113

Abstract: In accordance with an embodiment, a method of operating a piezoelectric transducer configured to transduce mechanical vibrations into transduced electrical signals at a pair of sensor electrodes includes stimulating a resonant oscillation of the piezoelectric transducer by applying at least one pulse electrical stimulation signal to the pair of sensor electrodes; detecting, at the pair of sensor electrodes, at least one electrical signal resulting from the stimulated resonant oscillation, wherein the at least one electrical signal resulting from the stimulated resonant oscillation oscillates at a resonance frequency of the piezoelectric transducer; measuring a frequency of oscillation of the at least one electrical signal resulting from the stimulated resonant oscillation to obtain a measured resonance frequency of the piezoelectric transducer; and tuning a stopband frequency of a notch filter coupled to the piezoelectric transducer to match the measured resonance frequency of the piezoelectric transducer.

公开(公告)号：US10483213B2

公开(公告)日：2019-11-19

申请号：US15703497

申请日：2017-09-13

Applicant: STMicroelectronics S.r.l.

Inventor： Giona Fucili ,  Agostino Mirabelli ,  Lorenzo Papillo

IPC: H01L21/66 ,  H01L23/544 ,  H01L23/525 ,  H01L21/67 ,  H01L21/78 ,  G01R31/317 ,  G11C17/16

Abstract: Many integrated circuit die are fabricated on a wafer. Each die includes integrated functional circuitry with an array of fuse elements that are visible to optical inspection. An electrical wafer sort is performed to test the integrated functional circuitry of each die. The array of fuse elements for each die on the wafer are programmed through the electrical wafer sort process with data bits defining a die identification that specifies a location of the die on the wafer. The die is then encapsulated in a package. In the event of package failure, a decapsulation is performed to access the die. Optical inspection of the array of fuse elements is then made to extract the die identification.

公开(公告)号：US20190081004A1

公开(公告)日：2019-03-14

申请号：US15703497

申请日：2017-09-13

Applicant: STMicroelectronics S.r.l.

Inventor： Giona Fucili ,  Agostino Mirabelli ,  Lorenzo Papillo

IPC: H01L23/544 ,  H01L23/525 ,  H01L21/67 ,  H01L21/66 ,  H01L21/78

Abstract: Many integrated circuit die are fabricated on a wafer. Each die includes integrated functional circuitry with an array of fuse elements that are visible to optical inspection. An electrical wafer sort is performed to test the integrated functional circuitry of each die. The array of fuse elements for each die on the wafer are programmed through the electrical wafer sort process with data bits defining a die identification that specifies a location of the die on the wafer. The die is then encapsulated in a package. In the event of package failure, a decapsulation is performed to access the die. Optical inspection of the array of fuse elements is then made to extract the die identification.