公开(公告)号：US10483213B2

公开(公告)日：2019-11-19

申请号：US15703497

申请日：2017-09-13

Applicant: STMicroelectronics S.r.l.

Inventor： Giona Fucili ,  Agostino Mirabelli ,  Lorenzo Papillo

IPC: H01L21/66 ,  H01L23/544 ,  H01L23/525 ,  H01L21/67 ,  H01L21/78 ,  G01R31/317 ,  G11C17/16

Abstract: Many integrated circuit die are fabricated on a wafer. Each die includes integrated functional circuitry with an array of fuse elements that are visible to optical inspection. An electrical wafer sort is performed to test the integrated functional circuitry of each die. The array of fuse elements for each die on the wafer are programmed through the electrical wafer sort process with data bits defining a die identification that specifies a location of the die on the wafer. The die is then encapsulated in a package. In the event of package failure, a decapsulation is performed to access the die. Optical inspection of the array of fuse elements is then made to extract the die identification.

公开(公告)号：US20190081004A1

公开(公告)日：2019-03-14

申请号：US15703497

申请日：2017-09-13

Applicant: STMicroelectronics S.r.l.

Inventor： Giona Fucili ,  Agostino Mirabelli ,  Lorenzo Papillo

IPC: H01L23/544 ,  H01L23/525 ,  H01L21/67 ,  H01L21/66 ,  H01L21/78

Abstract: Many integrated circuit die are fabricated on a wafer. Each die includes integrated functional circuitry with an array of fuse elements that are visible to optical inspection. An electrical wafer sort is performed to test the integrated functional circuitry of each die. The array of fuse elements for each die on the wafer are programmed through the electrical wafer sort process with data bits defining a die identification that specifies a location of the die on the wafer. The die is then encapsulated in a package. In the event of package failure, a decapsulation is performed to access the die. Optical inspection of the array of fuse elements is then made to extract the die identification.