公开(公告)号：USRE46671E1

公开(公告)日：2018-01-16

申请号：US14069136

申请日：2013-10-31

申请人： STMicroelectronics S.r.l.

发明人： Chantal Combi ,  Benedetto Vigna ,  Federico Giovanni Ziglioli ,  Lorenzo Baldo ,  Manuela Magugliani ,  Ernesto Lasalandra ,  Caterina Riva

IPC分类号： H01L29/84 ,  B81C1/00

CPC分类号： B81B7/0061 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R1/04 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.