公开(公告)号：US10382137B2

公开(公告)日：2019-08-13

申请号：US16014932

申请日：2018-06-21

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: G02B6/36 ,  H04B10/114 ,  H04J14/02 ,  H04B10/40 ,  G02B6/42 ,  H04B10/80 ,  H04B10/2575

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

公开(公告)号：US09405511B2

公开(公告)日：2016-08-02

申请号：US14524774

申请日：2014-10-27

Applicant: STMICROELECTRONICS (CANADA), INC. ,  STMICROELECTRONICS S.r.l.

Inventor： John Hogeboom ,  Hock Khor ,  Matteo Alessio Traldi ,  Anton Pelteshki

IPC: H03H7/06 ,  G06F7/72 ,  H03H17/06 ,  G06F5/16 ,  H04L25/02

CPC classification number: G06F7/724 ,  G06F5/16 ,  H03H17/06 ,  H04L25/0272 ,  H04L25/0288

Abstract: A FIR transmit architecture uses multiple driver divisions to allow signals with different delays to be summed into the output signal by the driver itself. The architecture includes a first multiplexer, a plurality of delay cells, a plurality of sign blocks, a switch block, a second multiplexer, and a plurality of drivers.

Abstract translation: FIR发送架构使用多个驱动器分区，以允许具有不同延迟的信号被驱动器自身求和到输出信号中。 该架构包括第一多路复用器，多个延迟单元，多个符号块，开关块，第二多路复用器和多个驱动器。

公开(公告)号：US20180302166A1

公开(公告)日：2018-10-18

申请号：US16014932

申请日：2018-06-21

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: H04B10/40 ,  G02B6/42 ,  H04B10/2575

CPC classification number: H04B10/40 ,  G02B6/36 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292 ,  H04B10/1143 ,  H04B10/2575 ,  H04B10/80 ,  H04J14/0209 ,  Y10T29/49002

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface..