Abstract:
In one aspect the invention provides a method of fabricating a laminate of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. According to the method a flexible and compliant layer of material which is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.
Abstract:
In one aspect the invention provides a laminated device of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. A flexible and compliant layer of material is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.
Abstract:
In one aspect the invention provides a method of fabricating a laminate of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. According to the method a flexible and compliant layer of material which is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.
Abstract:
In one aspect the invention provides a method of fabricating a laminate of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. According to the method a flexible and compliant layer of material which is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.
Abstract:
In one aspect the invention provides an electrical sensor having an electrical capacitance which varies with mechanical deformation to allow instrumenting of deformation by a connected electric circuit, the sensor comprising conductive material separated by dielectric material and operable to deform and change in capacitance with deformation of the capacitor, the capacitor arranged to have a structure of a twisted plane wherein the capacitor is supported in that arrangement by support material.