公开(公告)号：US20140174920A1

公开(公告)日：2014-06-26

申请号：US14163650

申请日：2014-01-24

Applicant: SULZER METAPLAS GMBH

Inventor： Joerg VETTER ,  Stefan ESSER ,  Juergen MUELLER ,  Georg ERKENS

IPC: H01J37/34 ,  H01J37/32

CPC classification number: H01J37/3414 ,  C23C14/243 ,  C23C14/325 ,  C23C14/3407 ,  H01J37/32055 ,  H01J37/32614 ,  H01J37/3423 ,  H01J37/3435 ,  H01J37/3497

Abstract: Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.

Abstract translation: 蒸发源，特别是用于溅射工艺或真空电弧蒸发工艺中，优选阴极真空电弧蒸发工艺。 蒸发源包括内基体，其设置在外承载体中并且相对于外承载体布置，使得在基体和载体之间形成与入口和出口流动连通的冷却空间 身体。 根据本发明，冷却空间包括流入空间和流出空间，并且流入空间经由用于冷却蒸发源的溢流连接与流出空间流动连通，使得冷却流体可以从 入口通过流入空间溢出连接和流出空间到出口。