公开(公告)号：US11170988B2

公开(公告)日：2021-11-09

申请号：US16638796

申请日：2017-08-31

申请人： SUMCO CORPORATION

发明人： Ryuichi Tanimoto ,  Ichiro Yamazaki ,  Shunsuke Mikuriya

IPC分类号： H01L21/02 ,  H01L21/302 ,  H01L21/321 ,  H01L21/306 ,  H01L21/304 ,  B24B7/22 ,  B24B37/04

摘要： Provided is a method of double-side polishing a silicon wafer using a double-side polishing apparatus, the method including in succession: a first polishing step of performing double-side polishing while supplying a first polishing agent that is an alkaline aqueous solution containing abrasive grains to the polishing cloths; a polishing agent switching step of stopping the supply of the first polishing agent and starting the supply of a second polishing agent that is an alkaline aqueous solution containing a water-soluble polymer with no abrasive grains, with the polishing cloths of the upper plate and the lower plate being in contact with the front surface and the back surface of the silicon wafer, respectively and with the upper plate and the lower plate being continuously rotated; and a second polishing step of performing double-side polishing while supplying the second polishing agent to the polishing cloths.

公开(公告)号：US11772231B2

公开(公告)日：2023-10-03

申请号：US16320841

申请日：2017-05-23

申请人： SUMCO CORPORATION

发明人： Shunsuke Mikuriya ,  Tomonori Miura

IPC分类号： B24B37/28 ,  H01L21/304 ,  B24B37/04 ,  B24B49/00

CPC分类号： B24B37/28 ,  B24B37/042 ,  B24B49/00 ,  H01L21/304

摘要： Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.

公开(公告)号：US11127584B2

公开(公告)日：2021-09-21

申请号：US16638193

申请日：2018-08-14

申请人： SUMCO CORPORATION

发明人： Shunsuke Mikuriya ,  Tomonori Miura

IPC分类号： H01L21/02 ,  B24B37/28

摘要： Provided a method of producing a carrier which make it possible to prevent the reduction in the flatness of a semiconductor wafer even if the semiconductor wafer is subjected to repeated double-side polishing procedures. The method of producing a carrier including a metal portion and a ring-shaped resin portion includes: a preparation step of preparing the metal portion and the resin portion (Step S1); a placement step of placing the resin portion in the retainer opening in the metal portion (Step S2); and a resin portion polishing step of polishing both surface of the resin portion (Step S4). The method includes, prior to the resin portion polishing step (Step S4), a production stage swelling step of swelling the resin portion placed in the retainer opening in the metal portion by impregnating the resin portion with a first liquid (Step S3).