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公开(公告)号：US4485087A
公开(公告)日：1984-11-27
申请号：US357540
申请日：1982-03-12
CPC分类号： A61K9/7061
摘要： A process for obtaining a composite pharmaceutical preparation which comprises coating or laminating a composition comprising(a) an adhesive substance having a pressure-sensitive adhesive property at room temperature, and(b) a percutaneous absorption type medicine which is solid at 0.degree. C.onto a polymer film capable of allowing the medicine in contact therewith to migrate through the polymer film, the composition being prepared by adding the medicine to the adhesive substance in a higher concentration than the solubility thereof in the adhesive substance.
摘要翻译： 一种获得复合药物制剂的方法，其包括涂覆或层压组合物，所述组合物包含（a）在室温下具有压敏粘合性质的粘合剂物质和（b）在0℃下为固体的经皮吸收型药物。 能够使与其接触的药物通过聚合物膜迁移的聚合物膜，该组合物通过以高于其在粘合物质中的溶解度的浓度将该药物添加到粘合剂物质中来制备。
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公开(公告)号：US4608249A
公开(公告)日：1986-08-26
申请号：US438422
申请日：1982-11-02
IPC分类号： A61K9/70 , A61L15/03 , A61K31/79 , C08F220/12
CPC分类号： A61K9/7053 , A61K9/7061
摘要： A hydrophilic therapeutic material comprising a carrier and a drug-containing patching layer formed thereon directly or indirectly, wherein said patching layer comprises a copolymer of 5 to 75% by weight of an acrylic or methacrylic ester having an ether group in the molecule, 85 to 15% by weight of an alkyl acrylate or alkyl methacrylate and 10 to 50% by weight of a polar monomer copolymerizable therewith.
摘要翻译： 一种亲水治疗材料，其包含直接或间接形成于其上的载体和含药剂的修补层，其中所述修补层包含5至75重量％的在分子中具有醚基的丙烯酸或甲基丙烯酸酯的共聚物，85至 15重量％的丙烯酸烷基酯或甲基丙烯酸烷基酯和10〜50重量％的与其共聚的极性单体。
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公开(公告)号：US5151271A
公开(公告)日：1992-09-29
申请号：US426526
申请日：1989-10-24
IPC分类号： A61K9/70
CPC分类号： A61K9/7053 , A61K9/7061 , A61K9/7076 , A61K9/7084
摘要： A pressure-sensitively adhering multilayer medicinal preparation comprises a pressure-sensitively adhering macromolecular substance layer and a polymer layer adjacent thereto and the drug and adjuvant incorporated in said preparation each can migrate from the layer of its original incorporation into the other, said adjuvant being capable of increasing absorption of the drug. In such preparation, the drug amount per unit volume can be increased.
摘要翻译： 压力敏感粘合性多层药物制剂包括压力敏感地粘附的大分子物质层和与其相邻的聚合物层，并且所述制剂中掺入的药物和佐剂各自可以从其原始掺入层迁移到另一个中，所述佐剂能够 增加药物的吸收。 在这样的制备中，可以增加每单位体积的药物量。
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4.发明授权Percutaneous absorption type pharmaceutical preparation of isosorbide dinitrate or pentaerythritol tetranitrate in pressure-sensitive laminate 失效硝酸异山梨酯或季戊四醇四硝酸酯在压敏层压板中的经皮吸收型药物制剂
公开(公告)号：US4420470A
公开(公告)日：1983-12-13
申请号：US338190
申请日：1982-01-08
CPC分类号： A61K9/7053 , A61K9/7061 , A61K9/7076
摘要： A pharmaceutical preparation comprising a flexible backing and a base material provided thereon is described wherein the base material consists essentially of a polymer having a glass transition temperature of from -70.degree. C. to -10.degree. C. and exhibiting pressure-sensitivity at room temperature, and isosorbide dinitrate or pentaerythritol tetranitrate. This pharmaceutical preparation is applied to the skin, and permits the active ingredient to be absorbed through the skin into the body at a constant rate, and gradually over a long period of time.
摘要翻译： 描述了一种包含柔性背衬和其上提供的基材的药物制剂，其中所述基材主要由玻璃化转变温度为-70℃至-10℃的聚合物组成，并且在室温下表现出压敏性 ，硝酸异山梨酯或季戊四醇四硝酸酯。 这种药物制剂适用于皮肤，并且允许活性成分以恒定的速率通过皮肤吸收到体内，并且逐渐地长时间地吸收。
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公开(公告)号：USD781932S1
公开(公告)日：2017-03-21
申请号：US29556625
申请日：2016-03-02
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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公开(公告)号：US07446022B2
公开(公告)日：2008-11-04
申请号：US11384355
申请日：2006-03-21
IPC分类号： H01L21/301 , B23K26/38
CPC分类号： B23K26/40 , B23K2103/172
摘要： A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse laser beam set to an output at which the protective film can be processed but the substrate can not be processed, to the protective film along the processing lines; and a second step for forming a second groove in the substrate along the first grooves by applying a second pulse laser beam set to an output at which the substrate can be processed, along the first grooves.
摘要翻译： 一种用于在沿着预定处理线的基板的处理表面上具有保护膜的晶片中形成凹槽的晶片激光加工方法，包括：通过施加第一工序，沿着分割线在保护膜中形成第一凹槽的第一步骤 将脉冲激光束设置到可以处理保护膜但不能处理衬底的输出到处理线的保护膜; 以及第二步骤，通过沿着第一凹槽施加第二脉冲激光束设置到可以处理基板的输出端，沿着第一凹槽在基板中形成第二凹槽。
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公开(公告)号：US20070190749A1
公开(公告)日：2007-08-16
申请号：US11705525
申请日：2007-02-13
申请人： Toshiyuki Yoshikawa
发明人： Toshiyuki Yoshikawa
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L24/743 , H01L2224/743 , H01L2924/00
摘要： A method for producing many semiconductor chips, each having a semiconductor circuit disposed on the face thereof and a die bonding film stuck to the back thereof, from a semiconductor wafer in which many rectangular regions are defined on its face by streets arranged in a lattice pattern, and the semiconductor circuit is disposed in each of the rectangular regions. The method comprises: a groove formation step of forming grooves of a predetermined depth along the streets on the face of the semiconductor wafer; a protective film sticking step of sticking a protective film to the face of the semiconductor wafer, where the grooves have been formed; a division step of grinding the back of the semiconductor wafer to render the thickness of the semiconductor wafer equal to or smaller than the depth of the groove, thereby dividing the rectangular regions individually; a die bonding film/holding film sticking step of sticking a die bonding film and a holding film, in this order, to the ground back of the semiconductor wafer; a protective film peeling step of peeling the protective film from the face of the semiconductor wafer; a spacing increasing step of stretching the holding film to increase spacing between the individually divided rectangular regions; and a die bonding film cutting step of irradiating the die bonding film with a laser beam from the face side of the semiconductor wafer through the clearance between the rectangular regions to cut the die bonding film along the clearance between the rectangular regions.
摘要翻译： 一种生产许多半导体芯片的方法，每个半导体芯片的半导体电路均设置在其表面上，并且芯片粘合膜粘附在其背面，半导体晶片在其表面上以矩阵形式布置了许多矩形区域 ，并且半导体电路设置在每个矩形区域中。 该方法包括：槽形成步骤，沿着半导体晶片的表面上的街道形成预定深度的槽; 保护膜粘贴步骤，其将保护膜粘贴到形成有凹槽的半导体晶片的表面上; 分割步骤，研磨半导体晶片的背面，使半导体晶片的厚度等于或小于凹槽的深度，从而分别划分矩形区域; 将芯片接合膜和保持膜依次粘接到半导体晶片的背面的芯片接合膜/保持膜贴附步骤; 保护膜剥离步骤，从半导体晶片的表面剥离保护膜; 间隔增加步骤，拉伸所述保持膜以增加所述单独分割的矩形区域之间的间隔; 以及芯片接合膜切割步骤，通过矩形区域之间的间隙从半导体晶片的正面侧用激光束照射芯片接合膜，以沿着矩形区域之间的间隙切割芯片接合膜。
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8.发明申请公开(公告)号：US20050169975A1
公开(公告)日：2005-08-04
申请号：US11048505
申请日：2005-01-31
CPC分类号： A61L15/26
摘要： To have acceptable moisture permeability and enable prevention of deformation due to swelling, the film base material for an adhesive skin patch includes an ether-based urethane resin obtained from at least one member selected from the group consisting of polyoxytetramethylene glycol, butanediol, polyethylene glycol, and polypropylene glycol as a diol component, and methylene diphenyl-diisocyanate as an isocyanate component. The film base material for an adhesive skin patch has a moisture permeability of preferably 800 to 4,000 g/m2·24 hrs. The adhesive skin patch can be produced by forming a pressure-sensitive adhesive layer on one side of the film base material for an adhesive skin patch.
摘要翻译： 为了具有可接受的透湿性并且能够防止由于溶胀引起的变形，用于粘合性皮肤贴剂的薄膜基材包括从选自聚氧四亚甲基二醇，丁二醇，聚乙二醇， 作为二醇成分的聚丙二醇和作为异氰酸酯成分的亚甲基二苯基二异氰酸酯。 用于粘合性皮肤贴剂的胶片基材料的透湿度优选为800〜4000g / m 2·24小时。 可以通过在用于粘合性皮肤贴剂的膜基材的一侧上形成压敏粘合剂层来制造粘合性皮肤贴剂。
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公开(公告)号：USD773864S1
公开(公告)日：2016-12-13
申请号：US29481220
申请日：2014-02-03
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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公开(公告)号：USD747768S1
公开(公告)日：2016-01-19
申请号：US29511389
申请日：2014-12-10
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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