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公开(公告)号：US07446022B2
公开(公告)日：2008-11-04
申请号：US11384355
申请日：2006-03-21
IPC分类号： H01L21/301 , B23K26/38
CPC分类号： B23K26/40 , B23K2103/172
摘要： A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse laser beam set to an output at which the protective film can be processed but the substrate can not be processed, to the protective film along the processing lines; and a second step for forming a second groove in the substrate along the first grooves by applying a second pulse laser beam set to an output at which the substrate can be processed, along the first grooves.
摘要翻译： 一种用于在沿着预定处理线的基板的处理表面上具有保护膜的晶片中形成凹槽的晶片激光加工方法，包括：通过施加第一工序，沿着分割线在保护膜中形成第一凹槽的第一步骤 将脉冲激光束设置到可以处理保护膜但不能处理衬底的输出到处理线的保护膜; 以及第二步骤，通过沿着第一凹槽施加第二脉冲激光束设置到可以处理基板的输出端，沿着第一凹槽在基板中形成第二凹槽。
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公开(公告)号：US20060216911A1
公开(公告)日：2006-09-28
申请号：US11384355
申请日：2006-03-21
IPC分类号： H01L21/00
CPC分类号： B23K26/40 , B23K2103/172
摘要： A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse laser beam set to an output at which the protective film can be processed but the substrate can not be processed, to the protective film along the processing lines; and a second step for forming a second groove in the substrate along the first grooves by applying a second pulse laser beam set to an output at which the substrate can be processed, along the first grooves.
摘要翻译： 一种用于在沿着预定处理线的基板的处理表面上具有保护膜的晶片中形成凹槽的晶片激光加工方法，包括：通过施加第一工序，沿着分割线在保护膜中形成第一凹槽的第一步骤 将脉冲激光束设置到可以处理保护膜但不能处理衬底的输出到处理线的保护膜; 以及第二步骤，通过沿着第一凹槽施加第二脉冲激光束设置到可以处理基板的输出端，沿着第一凹槽在基板中形成第二凹槽。
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3.发明授权公开(公告)号：US09090783B2
公开(公告)日：2015-07-28
申请号：US12707102
申请日：2010-02-17
CPC分类号： C09D5/32 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
摘要翻译： 根据本发明的用于激光切割的保护膜剂包括溶解在其中的水溶性树脂和至少一种选自水溶性染料，水溶性着色剂 ，和水溶性紫外线吸收剂。 将保护膜剂涂布在待加工的晶片的表面上，然后干燥以形成保护膜。 通过保护膜的激光切割从晶片产生芯片。 结果，可以在芯片的整个表面（包括它们的周缘部分）上有效地防止碎屑沉积。
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公开(公告)号：US07179723B2
公开(公告)日：2007-02-20
申请号：US10986371
申请日：2004-11-12
IPC分类号： H01L21/301
CPC分类号： H01L21/78 , B23K26/18 , B23K26/364 , H01L21/67092
摘要： A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.
摘要翻译： 一种用于通过将激光束施加到预定区域来处理晶片的激光束处理方法，包括以下步骤：在晶片的待处理表面上形成吸收激光束的树脂膜; 通过树脂膜将激光束施加到待加工晶片的表面; 并且在激光束施加步骤之后去除树脂膜。
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公开(公告)号：US20050106782A1
公开(公告)日：2005-05-19
申请号：US10986371
申请日：2004-11-12
IPC分类号： B23K26/00 , B23K26/18 , B23K26/40 , B23K101/40 , H01L21/00 , H01L21/301 , H01L21/44 , H01L21/78
CPC分类号： H01L21/78 , B23K26/18 , B23K26/364 , H01L21/67092
摘要： A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.
摘要翻译： 一种用于通过将激光束施加到预定区域来处理晶片的激光束处理方法，包括以下步骤：在晶片的待处理表面上形成吸收激光束的树脂膜; 通过树脂膜将激光束施加到待加工晶片的表面; 并且在激光束施加步骤之后去除树脂膜。
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6.发明申请公开(公告)号：US20060105544A1
公开(公告)日：2006-05-18
申请号：US11251810
申请日：2005-10-18
IPC分类号： H01L21/78
CPC分类号： C09D5/32 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
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7.发明授权Method of detecting condensing spot position in laser beam processing apparatus 有权检测激光束处理装置中聚光点位置的方法公开(公告)号：US08957347B2
公开(公告)日：2015-02-17
申请号：US13617046
申请日：2012-09-14
IPC分类号： H01L21/30 , H01L21/304 , B23K26/00 , B23K26/04 , B23K26/40
CPC分类号： B23K26/048 , B23K26/00 , B23K26/0006 , B23K26/40 , B23K2103/50 , B23K2103/56 , H01L21/30 , H01L21/304 , H01L21/3043 , H01L2221/00
摘要： A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.
摘要翻译： 一种检测激光束处理装置中的聚光点位置的方法，包括：检测位置设定步骤，在从所述冷凝器的检测位置的起始点到终点的范围内设定多个Z轴方向位置 定位 激光束处理槽形成步骤，将冷凝器顺序地定位在从起点到终点的范围内的检测位置，每当改变冷凝器的检测位置时，通过操作分度输送装置执行预定的间隔分度进给， 以及在所述冷凝器的每个检测位置处，在所述板状体中形成预定长度的激光束处理槽; 以及激光束处理槽成像步骤，通过成像装置对形成在板状体中的激光束处理槽进行成像。
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公开(公告)号：USD773864S1
公开(公告)日：2016-12-13
申请号：US29481220
申请日：2014-02-03
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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公开(公告)号：USD747768S1
公开(公告)日：2016-01-19
申请号：US29511389
申请日：2014-12-10
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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10.发明授权公开(公告)号：US07678959B2
公开(公告)日：2010-03-16
申请号：US11711111
申请日：2007-02-27
IPC分类号： A61F15/00
CPC分类号： A61F13/0253 , A61F13/0209 , A61F13/0226 , A61F2013/00327 , A61F2013/00412 , A61F2013/00582 , Y10T428/24355
摘要： The present invention relates to a film base material for an adhesive skin patch, which includes an elastomer film unevenly having unevenness on at least one surface thereof, in which, in one unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the longest among the plurality of unevenness, the distance is within the range of from 1 to 5 μm; in another unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the shortest among the plurality of unevenness, the distance is within the range of from 0.1 to 0.9 μm; and the 10-point average roughness of the surface is within the range of from 0.5 μm to 3 μm, and which is decreased in glossy texture on the surface thereof and inconspicuous when it is applied to the skin or the like; and the adhesive skin patch including the film base material.
摘要翻译： 本发明涉及一种用于粘合性皮肤贴剂的薄膜基材，其包括在其至少一个表面上不均匀地具有不均匀性的弹性体膜，其中在垂直于弹性体膜表面之间的距离 凹凸的顶部和底部是多个凹凸中最长的距离，在1〜5μm的范围内; 在垂直于弹性体膜的表面之间的凹凸的顶部与其底部之间的距离在多个凹凸之中最短的另一个凹凸中，该距离在0.1至0.9μm的范围内; 并且表面的10点平均粗糙度在0.5μm至3μm的范围内，并且其表面上的光泽质地减小并且当其施加到皮肤等时不显眼; 以及包括膜基材的粘合性皮肤贴剂。
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