DISPLAY DEVICE
    4.
    发明申请

    公开(公告)号:US20250081744A1

    公开(公告)日:2025-03-06

    申请号:US18658219

    申请日:2024-05-08

    Abstract: A display device includes a first substrate, a transistor on the first substrate, a pixel electrode disposed on the transistor and connected to the transistor, a pixel defining layer on the pixel electrode, a spacer on the pixel defining layer, and a second substrate on the spacer. The spacer includes a first spacer disposed at a center of the first substrate and a second spacer disposed at an edge of the first substrate in a plan view, and the second spacer has a width that gradually increases in a direction from the first substrate toward the second substrate.

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20250057013A1

    公开(公告)日:2025-02-13

    申请号:US18662824

    申请日:2024-05-13

    Abstract: A display device includes a substrate including a display area and a first non-display area around the display area; a light emitting element on the display area of the substrate in the display area; a lower inorganic encapsulation film on the substrate in the display area and the first non-display area; an organic encapsulation film on the lower inorganic encapsulation film; an upper inorganic encapsulation film on the organic encapsulation film; and a first dam between the lower inorganic encapsulation film and the upper inorganic encapsulation film in the first non-display area, wherein a first side surface of the first dam is in contact with the organic encapsulation film, and a second side surface of the first dam different from the first side surface of the first dam is in contact with the upper inorganic encapsulation film.

    DISPLAY DEVICE
    7.
    发明申请

    公开(公告)号:US20210175471A1

    公开(公告)日:2021-06-10

    申请号:US16934122

    申请日:2020-07-21

    Abstract: A display device may include a substrate and a light emitting element disposed on the substrate. An encapsulation layer covers the light emitting element. The encapsulation layer includes at least two inorganic encapsulation layers and at least one organic encapsulation layer. The at least one organic encapsulation layer includes a first organic material having a permittivity less than or equal to about 3.0. A low permittivity layer is disposed on the encapsulation layer. The low permittivity layer includes a second organic material and first hollow particles dispersed in the second organic material. An input sensing layer is disposed on the low permittivity layer.

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