Display device and method of fabricating the same

    公开(公告)号:US11527522B2

    公开(公告)日:2022-12-13

    申请号:US17349433

    申请日:2021-06-16

    Abstract: A method of fabricating a display device includes forming a circuit layer on a base layer, forming a first preliminary electrode and a second preliminary electrode on the circuit layer, forming a photoresist layer on the first preliminary electrode and the second preliminary electrode, patterning the photoresist layer to form a photoresist pattern, treating a region of each of the first preliminary electrode and the second preliminary electrode to form a first electrode and a second electrode having regions of lower and higher electrical resistance, and disposing a light-emitting element on the first electrode and the second electrode at regions having lower electrical resistance.

    Organic light emitting display device and method of manufacturing organic light emitting display device

    公开(公告)号:US11217634B2

    公开(公告)日:2022-01-04

    申请号:US16708950

    申请日:2019-12-10

    Abstract: An organic light emitting display device includes a substrate, an insulation layer structure, a light emitting layer, and an optical module. The substrate has an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region. An opening is defined through the substrate in the opening region. The insulation layer structure is disposed in the display region and the peripheral region on the substrate. The light emitting layer is disposed on the insulation layer structure, and extends in a first direction from the display region into the opening region. A first opening is defined through the light emitting layer in the peripheral region. The optical module is disposed in the opening of the substrate.

    Display device and method of fabricating the same

    公开(公告)号:US11545476B2

    公开(公告)日:2023-01-03

    申请号:US17370523

    申请日:2021-07-08

    Abstract: A method of fabricating a display device includes forming a circuit layer on a base layer, forming a first preliminary electrode and a second preliminary electrode on the circuit layer, forming a photoresist layer on the first preliminary electrode and the second preliminary electrode, patterning the photoresist layer to form a photoresist pattern, treating a region of each of the first preliminary electrode and the second preliminary electrode to form a first electrode and a second electrode having regions of lower and higher electrical resistance, and disposing a light-emitting element on the first electrode and the second electrode at regions having lower electrical resistance.

    Optical sensor, electronic apparatus including the same and manufacturing method thereof

    公开(公告)号:US11361581B2

    公开(公告)日:2022-06-14

    申请号:US16999672

    申请日:2020-08-21

    Abstract: An optical sensor includes: a sensing unit including a first sensing electrode, a second sensing electrode spaced apart from the first sensing electrode, and a sensing layer between the first sensing electrode and the second sensing electrode, the sensing layer containing amorphous silicon and germanium (Ge) ions impregnated in the amorphous silicon; and an optical pattern unit on the sensing unit and including a light shielding pattern and a plurality of transmission patterns in the light shielding pattern, wherein the sensing layer includes a first region, a second region, and a third region sequentially arranged from a boundary between the second sensing electrode and the sensing layer toward the first electrode, and a concentration of the germanium (Ge) ions in the amorphous silicon is relatively higher in the second region than in the first region and the third region.

    Organic light emitting diode display device

    公开(公告)号:US11063093B2

    公开(公告)日:2021-07-13

    申请号:US16708894

    申请日:2019-12-10

    Abstract: An organic light emitting diode display device includes a substrate, a buffer layer, a first circuit structure, a sub-pixel structure, and a first signal wire. The substrate includes a display region including a plurality of sub-pixel regions and a peripheral region surrounding the display region. The buffer layer is disposed in the display region and peripheral region on the substrate. The first circuit structure is disposed in the peripheral region on the buffer layer. The sub-pixel structure is disposed in each of the sub-pixel regions on the first circuit structure. The first signal wire is disposed in the peripheral region between the substrate and the buffer layer, and overlaps the first circuit structure when viewed from a plan view in a thickness direction of the substrate.

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