SUBSTRATE DETACHING APPARATUS
    3.
    发明申请
    SUBSTRATE DETACHING APPARATUS 有权
    基板拆卸装置

    公开(公告)号:US20160243811A1

    公开(公告)日:2016-08-25

    申请号:US14919298

    申请日:2015-10-21

    Abstract: The present invention aims at reducing a breaking phenomenon of an adsorbed substrate while the substrate is detached from a lower plate at a high speed. An embodiment is a substrate detaching apparatus including an adsorption main body disposed on one side of the adsorbed substrate to generate an adsorption force; and a plurality of adsorption parts provided in a predetermined adsorption region of the substrate under the adsorption main body, being spaced apart from each other and applied with an adsorption force from the adsorption main body to adsorb the substrate, wherein the adsorption region includes an outer region of a first cycloid curved line protruding in a third corner direction based on a diagonal connecting between a first corner and a second corner of the adsorbed substrate and an outer region of a second cycloid curved line protruding in a fourth corner direction.

    Abstract translation: 本发明的目的在于降低吸附的基板的断裂现象,同时高速地将基板与下板分离。 一个实施例是一种衬底分离装置,其包括设置在吸附基板的一侧上以产生吸附力的吸附主体; 以及多个吸附部,其设置在吸附主体下方的基板的预定吸附区域中,彼此间隔开并且被吸附主体吸附吸附基板的吸附力,其中吸附区域包括外部 基于吸附基板的第一角部和第二角部之间的对角连接以及沿第四角方向突出的第二摆线曲线的外侧区域,以第三角度方向突出的第一摆线曲线的区域。

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