SUBSTRATE FIXING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    SUBSTRATE FIXING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    基板固定装置及其制造方法

    公开(公告)号:US20140063680A1

    公开(公告)日:2014-03-06

    申请号:US13745954

    申请日:2013-01-21

    Abstract: In a substrate fixing device and a method form manufacturing the substrate fixing device, the substrate fixing device includes a lower electrode, a dielectric layer and a plurality of protrusions. The dielectric layer is disposed on the lower electrode. The protrusions are spaced apart from each other, and are protruded from the dielectric layer. Each of the protrusions includes an insulating layer disposed on the dielectric layer, and an upper layer disposed on the insulating layer and contacting a substrate.

    Abstract translation: 在基板固定装置和制造基板固定装置的方法形式中,基板固定装置包括下电极,电介质层和多个突起。 电介质层设置在下电极上。 突起彼此间隔开,并从电介质层突出。 每个突起包括设置在电介质层上的绝缘层,以及设置在绝缘层上并与衬底接触的上层。

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