Abstract:
An exemplary embodiment provides a thin film transistor array panel, including: a substrate; an oxide semiconductor layer disposed on the substrate; an insulating layer disposed on the oxide semiconductor layer; and a pixel electrode disposed on the insulating layer. The oxide semiconductor layer includes a first layer and a second layer disposed on the first layer, the second layer includes an oxide semiconductor including silicon, and the second layer contacts the insulating layer.
Abstract:
Provided are chip-on-film package and display device including the same. The chip-on-film package comprises: a base film; a driving chip which is disposed on a surface of the base film; and a heat radiating member which is disposed on the driving chip and comprises a first heat radiating pad portion, a second heat radiating pad portion separated from the first heat radiating pad portion in a first direction, a connecting portion disposed between the first heat radiating pad portion and the second heat radiating pad portion, and one or more protrusions extending from the first heat radiating pad portion or the second heat radiating pad portion along an oblique direction in the first direction, wherein the connecting portion at least partially overlaps the driving chip.
Abstract:
A liquid crystal display according to an exemplary embodiment of the present disclosure includes: a first substrate where a pixel electrode is formed; a second substrate facing the first substrate; a liquid crystal layer provided between the first substrate and the second substrate; and a driving device connected with the first substrate, wherein the first substrate includes a pixel area where pixels emit light, and a load storage area provided between the pixel area and the driving device and constantly maintaining a load applied to the pixels in the pixel area.