公开(公告)号：US20140321071A1

公开(公告)日：2014-10-30

申请号：US14054308

申请日：2013-10-15

Applicant: Samsung Display Co., Ltd.

Inventor： You Bean KIM ,  Seock-Hwan KANG ,  Jong Seo LEE

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/024 ,  H05K2201/0195 ,  H05K2201/09972

Abstract: A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve reliability of the printed circuit board.

Abstract translation: 印刷电路板包括与高速信号线层相邻的绝缘层。 在高速信号线层和绝缘层之间设置低损耗材料层。 结果，可以减少高速信号线层的频率损失并提高印刷电路板的可靠性。