公开(公告)号：US20150189757A1

公开(公告)日：2015-07-02

申请号：US14206254

申请日：2014-03-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong-Won KIM ,  Keun-Yong LEE ,  Young-Do KWEON

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K3/4602 ,  H05K2201/10522

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract translation: 公开了一种电子部件嵌入式基板。 根据本发明实施例的电子部件嵌入式基板包括：其中形成有腔的芯基板; 多个电子部件，其嵌入到所述空腔内并以规定的格式配置; 以及插入在所述多个电子部件之间的多个电介质间隔件，所述多个电子部件在所述空腔中彼此相邻。

公开(公告)号：US20160196913A1

公开(公告)日：2016-07-07

申请号：US14967975

申请日：2015-12-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong-Won KIM ,  Jeong-Min CHO ,  Jin-Gu KIM

IPC: H01F17/00 ,  H01F41/00 ,  H01F17/04

CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F41/046

Abstract: Disclosed is a coil component and method of manufacturing the coil component. The coil component includes a core magnetic layer, coil conductors formed on two opposing surfaces of the core magnetic layer, and outer magnetic layers laminated on the core magnetic layer and covering the coil conductors.

Abstract translation: 公开了一种线圈部件和线圈部件的制造方法。 线圈部件包括芯磁性层，形成在芯磁性层的两个相对表面上的线圈导体和层叠在芯磁性层上并覆盖线圈导体的外磁层。

公开(公告)号：US20160196906A1

公开(公告)日：2016-07-07

申请号：US14989192

申请日：2016-01-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong-Won KIM ,  Jeong-Min CHO ,  Jin-Gu KIM

IPC: H01F1/147 ,  H01F27/29 ,  H01F41/02 ,  H01F27/28

CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F27/29 ,  H01F41/046

Abstract: A coil-embedded substrate and a method of manufacturing the same are provided. The coil-embedded substrate includes a substrate having a hollow portion disposed therein, a coil conductor disposed in the substrate and having a spiral shape winding about the hollow portion, a magnetic core disposed in the hollow portion, and a cover layer covering the substrate and the hollow portion.

Abstract translation: 提供了一种线圈嵌入式基板及其制造方法。 线圈嵌入式基板包括具有设置在其中的中空部的基板，设置在基板中并具有围绕中空部缠绕的螺旋状的线圈导体，设置在中空部的磁芯和覆盖基板的覆盖层， 中空部分。

公开(公告)号：US20160276090A1

公开(公告)日：2016-09-22

申请号：US15072812

申请日：2016-03-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin-Gu KIM ,  Ichiro OGURA ,  Hong-Won KIM ,  Sang-Moon LEE ,  Kwang-Jik LEE ,  Myung-Jae YOO

IPC: H01F27/255 ,  H01F41/04 ,  H01F41/02 ,  H01F41/10 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/292 ,  H01F41/046

Abstract: A coil component and a method of manufacturing a coil component are disclosed. The coil component includes an insulation layer including a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a magnetic core.

Abstract translation: 公开了一种线圈部件和制造线圈部件的方法。 线圈部件包括包括线圈导体的绝缘层和设置在绝缘层上的磁性树脂复合层。 磁性树脂复合层包括磁芯。

公开(公告)号：US20160254086A1

公开(公告)日：2016-09-01

申请号：US15054600

申请日：2016-02-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin-Gu KIM ,  Ichiro OGURA ,  Hong-Won KIM ,  Seung-Wook PARK ,  Jeong-Min CHO

IPC: H01F27/22 ,  H01F27/255 ,  H01F27/28

CPC classification number: H01F27/22 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01F2017/0066

Abstract: A coil component includes an insulation layer having a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a heat-dissipating filler.

Abstract translation: 线圈部件包括具有线圈导体的绝缘层和设置在绝缘层上的磁性树脂复合层。 磁性树脂复合层包括散热填料。