公开(公告)号：US20150189757A1

公开(公告)日：2015-07-02

申请号：US14206254

申请日：2014-03-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong-Won KIM ,  Keun-Yong LEE ,  Young-Do KWEON

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K3/4602 ,  H05K2201/10522

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract translation: 公开了一种电子部件嵌入式基板。 根据本发明实施例的电子部件嵌入式基板包括：其中形成有腔的芯基板; 多个电子部件，其嵌入到所述空腔内并以规定的格式配置; 以及插入在所述多个电子部件之间的多个电介质间隔件，所述多个电子部件在所述空腔中彼此相邻。

公开(公告)号：US20170086292A1

公开(公告)日：2017-03-23

申请号：US15202037

申请日：2016-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun-Sil KIM ,  Keun-Yong LEE ,  Seong-Hyun YOO ,  Sang-Hyun SHIN ,  Jin-Ho HONG

IPC: H05K1/03 ,  B32B27/06 ,  B32B37/10 ,  B32B37/06 ,  H05K3/00 ,  B32B37/14

CPC classification number: B32B27/06 ,  B32B5/024 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B37/06 ,  B32B37/10 ,  B32B37/144 ,  B32B38/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/18 ,  B32B2305/77 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0187 ,  H05K2201/0195

Abstract: A prepreg includes a core layer, a first resin layer including a first resin material and laminated on a first side of the core layer, the first resin material impregnating a portion of the core layer, and a second resin layer including a second resin material and laminated on a second side of the core layer, the second resin material impregnating a portion of the core layer so as to form a non-linear joint interface with the first resin material.

公开(公告)号：US20170086290A1

公开(公告)日：2017-03-23

申请号：US15099212

申请日：2016-04-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Keun-Yong LEE ,  Jun-Young KIM ,  Sa-Yong LEE ,  Sang-Hyun SHIN

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/026

Abstract: A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.