公开(公告)号：US20160165723A1

公开(公告)日：2016-06-09

申请号：US14955748

申请日：2015-12-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Christian ROMERO ,  Kyung-Seob OH ,  Jeong-Ho LEE ,  Young-Do KWEON

IPC: H05K1/11 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A circuit board, and a package substrate and an electronic device that includes a circuit board are disclosed. The circuit board includes a core layer, a base pattern layer disposed on the core layer and a through-hole conductor that goes through the core layer, the base pattern layer including a circuit pattern that includes a conductive pad on the through-hole conductor, an insulator layer including at least one insulating layer stacked on the core layer and the base pattern layer, and a laminated pattern layer including a plurality of vias and a laminated circuit pattern, the plurality of vias penetrating the insulating layer, and the laminated circuit pattern being disposed on the insulating layer and including a plurality of via pads formed on the vias respectively.

Abstract translation: 公开了一种电路板，封装基板和包括电路板的电子设备。 电路板包括芯层，设置在芯层上的基底图案层和穿过芯层的通孔导体，基底图案层包括在通孔导体上包括导电焊盘的电路图案， 包括堆叠在芯层和基底图案层上的至少一个绝缘层的绝缘体层，以及包括多个通孔和层叠电路图案的层叠图案层，穿过绝缘层的多个通孔和层叠电路图案 设置在绝缘层上并且分别包括形成在通孔上的多个通孔焊盘。

公开(公告)号：US20160316557A1

公开(公告)日：2016-10-27

申请号：US14871357

申请日：2015-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong-Ho LEE ,  Young-Do KWEON ,  Hyoung-Joon KIM ,  Kyoung-Moo HARR ,  Kyung-Seob OH

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K3/0094 ,  H01L23/52 ,  H01L2224/16225 ,  H05K1/181 ,  H05K1/182 ,  H05K1/186 ,  H05K3/4046 ,  H05K3/4694 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10545 ,  Y02P70/611

Abstract: A printed circuit board, a method of manufacturing a printed circuit board, and an electronic component module including a printed circuit board are provided. The printed circuit board includes a circuit board having a cavity, and a connection board including metal patterns, the connection board disposed in the cavity with the metal patterns disposed substantially vertically in the circuit board.

Abstract translation: 提供印刷电路板，印刷电路板的制造方法以及包括印刷电路板的电子部件模块。 印刷电路板包括具有空腔的电路板和包括金属图案的连接板，连接板设置在空腔中，金属图案基本垂直地布置在电路板中。