公开(公告)号：US20140079924A1

公开(公告)日：2014-03-20

申请号：US13827527

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok MOON ,  Hyun Jun Lee ,  Jeong Kyu Lee ,  Seong Hyun Yoo ,  Keun Yong Lee

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K2201/0209 ,  Y10T428/24917

Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.

Abstract translation: 本发明涉及一种用于封装基板的树脂组合物和包括芯层和使用该芯层的预浸料的封装基板，其包括聚酯酰胺液晶低聚物，双酚四官能环氧树脂，固化剂和无机填料 其中双酚四官能环氧树脂的粘度大于20,000cps。 根据本发明的封装基板用树脂组合物，通过提高基板材料的散热特性，能够提供具有降低的基板翘曲的封装基板。 此外，可以通过减小基板翘曲特性来减少芯片和基板之间的剥离或焊料球的裂纹的发生来改善缺陷。

公开(公告)号：US20150147542A1

公开(公告)日：2015-05-28

申请号：US14334956

申请日：2014-07-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok MOON ,  Dae Hui Jo ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Young Kim ,  Geum Hee Yun

IPC: H05K1/03 ,  C08L63/00

CPC classification number: C08L63/00 ,  C08G59/24 ,  C08G59/3218 ,  H05K1/0326 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/0141 ,  Y10T428/24917 ,  Y10T428/31529

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract translation: 一种用于印刷电路板的树脂组合物和由其形成的印刷电路板。 用于印刷电路板的树脂组合物可以具有：在至少一端包含化学式1的结构单元和化学式2的结构单元并且包含化学式E的官能团的液晶低聚物; 和化学式N的醚型萘系环氧树脂。根据示例性实施方式，即使印刷电路板变薄，薄且小型化，也可以确保印刷电路板的电，热和机械稳定性 。