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公开(公告)号：US11948750B2
公开(公告)日：2024-04-02
申请号：US17487323
申请日：2021-09-28
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
CPC分类号： H01G4/232 , H01G2/065 , H01G4/30 , H01G4/1227
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US20220084751A1
公开(公告)日：2022-03-17
申请号：US17239158
申请日：2021-04-23
发明人： Seung Min Ahn , Beom Joon Cho , Ki Young Kim
摘要： An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.
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公开(公告)号：US10886071B2
公开(公告)日：2021-01-05
申请号：US16272752
申请日：2019-02-11
发明人： Ki Young Kim , Woo Chui Shin , Beom Joon Cho , Sang Soo Park
摘要： An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.
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公开(公告)号：US10529496B1
公开(公告)日：2020-01-07
申请号：US16169912
申请日：2018-10-24
发明人： Beom Joon Cho , Sang Soo Park , Ki Young Kim , Woo Chul Shin
摘要： An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.
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公开(公告)号：US11302481B2
公开(公告)日：2022-04-12
申请号：US16867849
申请日：2020-05-06
发明人： Beom Joon Cho , Jae Young Na , Ki Young Kim , Ji Hong Jo , Woo Chul Shin
摘要： An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.
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公开(公告)号：US20220102074A1
公开(公告)日：2022-03-31
申请号：US17327941
申请日：2021-05-24
发明人： Mi Na Hyun , Beom Joon Cho , Ki Young Kim
摘要： An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames connected to the pair of external electrodes, respectively. A coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of a solder.
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公开(公告)号：US11276529B2
公开(公告)日：2022-03-15
申请号：US16850768
申请日：2020-04-16
发明人： Jae Young Na , Ki Young Kim , Beom Joon Cho , Ji Hong Jo , Woo Chul Shin
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).
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公开(公告)号：US20220013290A1
公开(公告)日：2022-01-13
申请号：US17487323
申请日：2021-09-28
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US11164699B2
公开(公告)日：2021-11-02
申请号：US16401583
申请日：2019-05-02
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US10854389B2
公开(公告)日：2020-12-01
申请号：US16821042
申请日：2020-03-17
发明人： Beom Joon Cho , Woo Chul Shin , Ki Young Kim , Sang Soo Park
摘要： An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.
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