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公开(公告)号：US11277113B2
公开(公告)日：2022-03-15
申请号：US16936807
申请日：2020-07-23
发明人： Seung Wook Park , Jae Hyun Jung , Jae Chang Lee , Dae Hun Jeong , Sang Uk Son , Seong Hun Na
摘要： A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.
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公开(公告)号：US11177789B2
公开(公告)日：2021-11-16
申请号：US15996790
申请日：2018-06-04
发明人： Seung Wook Park , Jae Hyun Jung , Seong Hun Na
摘要： An acoustic wave device includes a substrate, a support portion and a protective member. The substrate has an acoustic wave generator formed on a surface thereof. The support portion is disposed on the surface of the substrate, and includes an accommodating space configured to accommodate the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by a predetermined interval. The protective member is disposed in a seating groove formed in the support portion.
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公开(公告)号：US10715100B2
公开(公告)日：2020-07-14
申请号：US15674833
申请日：2017-08-11
发明人： Seong Hun Na , Jae Hyun Jung , Seung Wook Park
IPC分类号： H01L41/053 , H01L41/22 , H03H9/25 , H03H9/02 , H03H3/08 , H01L41/09 , H01L41/18 , H03H9/145 , H01L41/332
摘要： An acoustic wave filter device includes a substrate, a filter disposed on the substrate, a wall member disposed on the substrate and surrounding the filter, and a cap member disposed above the wall member and, with the wall member, forming an internal space. The cap member has a curved shape and comprises a first cap member comprising a first material and a second cap member comprising a second material.
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公开(公告)号：US10432170B2
公开(公告)日：2019-10-01
申请号：US15675137
申请日：2017-08-11
发明人： Jae Hyun Jung , Seung Wook Park , Seong Hun Na
IPC分类号： H03H9/10 , H03H9/17 , H01L41/047 , H03H9/25 , H03H9/64 , H03H9/05 , H03H9/02 , H01L41/053
摘要： An acoustic wave filter device includes a filter disposed on a substrate, a wall member disposed on the substrate and surrounding the filter, a cap member disposed on the wall member and bounding an internal space with the wall member; and a support member disposed on the cap member. The support member is disposed above the internal space and includes a bump disposed on the cap member.
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公开(公告)号：US11476832B2
公开(公告)日：2022-10-18
申请号：US16540480
申请日：2019-08-14
发明人： Seung Wook Park , Tae Kyung Lee , Seong Hun Na , Jae Chang Lee , Jae Hyun Jung
IPC分类号： H03H9/10 , H03H9/05 , H01L41/09 , H01L41/053 , H03H3/02 , H03H9/60 , H01L41/047 , H03H9/17 , H03H9/58 , H03H9/02 , H01L41/332
摘要： A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.
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公开(公告)号：US11171096B2
公开(公告)日：2021-11-09
申请号：US16655284
申请日：2019-10-17
发明人： Seung Wook Park , Jae Chang Lee , Seong Hun Na , Jae Hyun Jung
摘要： A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.
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公开(公告)号：US11437563B2
公开(公告)日：2022-09-06
申请号：US15972499
申请日：2018-05-07
发明人： Seung Wook Park , Jae Hyun Jung , Seong Hun Na
摘要： An acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.
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公开(公告)号：US10903816B2
公开(公告)日：2021-01-26
申请号：US16430696
申请日：2019-06-04
发明人： Seung Wook Park , Jae Chang Lee , Jae Hyun Jung , Seong Hun Na
IPC分类号： H03H9/10 , H03H9/15 , H03H9/17 , H03H9/05 , H01L27/20 , H03H9/13 , H03H9/00 , H01L23/00 , B81B7/00 , B81C1/00
摘要： A thin-film package includes: a substrate; a wiring layer disposed on the substrate; a microelectromechanical systems (MEMS) element disposed on a surface of the substrate; a partition wall disposed on the substrate to surround the MEMS element, and formed of a polymer material; a cap forming a cavity with the substrate and the partition wall; and an external connection electrode connected to the wiring layer. The external connection electrode includes at least one inclined portion disposed on at least one inclined surface formed on any one or any combination of any two or more of the substrate, the partition wall, and the cap.
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公开(公告)号：US10483618B2
公开(公告)日：2019-11-19
申请号：US15997748
申请日：2018-06-05
发明人： Seung Wook Park , Tah Joon Park , Jae Hyun Jung , Hwa Sun Lee , Seong Hun Na
IPC分类号： H01L23/552 , H01Q1/22 , H01Q1/44 , G06K19/077 , H01L23/66 , H01L23/31 , H01L23/00 , H01L23/538 , H01Q1/48 , H01Q9/04 , H01Q21/00 , H01Q21/06 , H01Q1/40 , H01Q21/30
摘要： A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.
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公开(公告)号：US10164602B2
公开(公告)日：2018-12-25
申请号：US15190286
申请日：2016-06-23
摘要： An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.
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