公开(公告)号：US20200154568A1

公开(公告)日：2020-05-14

申请号：US16674507

申请日：2019-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Byung-Duk NA ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Mi-Sun HWANG ,  Hee-Joon CHUN ,  Deok-Man KANG ,  Sun-A KIM

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.

公开(公告)号：US20200178392A1

公开(公告)日：2020-06-04

申请号：US16663419

申请日：2019-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi-Sun HWANG ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Byung-Duk NA ,  Hee-Joon CHUN ,  Sun-A KIM ,  Deok-Man KANG

IPC: H05K1/11 ,  H05K3/00

Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.

公开(公告)号：US20200178390A1

公开(公告)日：2020-06-04

申请号：US16676499

申请日：2019-11-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi-Sun HWANG ,  Sun-A KIM

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42

Abstract: A printed circuit board includes an insulating layer, a pad, and a via fill. The insulating layer includes a via hole. The pad is formed in the insulating layer such that an intermediate portion thereof is exposed by the via hole. The pad includes a through hole formed in the intermediate portion. The via fill is formed in the via hole, configured to fill the through hole, and coupled to the intermediate portion.