公开(公告)号：US20170055345A1

公开(公告)日：2017-02-23

申请号：US15084864

申请日：2016-03-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Han KIM ,  Han KIM ,  Mi-Sun HWANG ,  Sang-Yul HA ,  Seok-Hwan AHN ,  Kyung-Ho LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K3/0017 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/2009

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘基板，设置在绝缘基板上的电路，在绝缘基板上空间分离的一对第一加强件，平行于绝缘基板的表面延伸的第一加强件，以及第二加强件， 一对第一加强。

公开(公告)号：US20160381794A1

公开(公告)日：2016-12-29

申请号：US15196857

申请日：2016-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok-Hwan AHN ,  Mi-Sun HWANG ,  Young-Gwan KO ,  Jong-Seok BAE ,  Myung-Sam KANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K3/12 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/115 ,  H05K1/165 ,  H05K3/007 ,  H05K3/0076 ,  H05K3/12 ,  H05K3/4007 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/09136 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09672 ,  H05K2203/043

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract translation: 多层基板包括在其厚度方向上层叠的单位基板，并且单位基板包括光敏绝缘层，设置在感光绝缘层中的导电图案，以及突出到光敏绝缘层中的凸块，并提供到 导电图案。

公开(公告)号：US20200178392A1

公开(公告)日：2020-06-04

申请号：US16663419

申请日：2019-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi-Sun HWANG ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Byung-Duk NA ,  Hee-Joon CHUN ,  Sun-A KIM ,  Deok-Man KANG

IPC: H05K1/11 ,  H05K3/00

Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.

公开(公告)号：US20200178390A1

公开(公告)日：2020-06-04

申请号：US16676499

申请日：2019-11-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi-Sun HWANG ,  Sun-A KIM

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42

Abstract: A printed circuit board includes an insulating layer, a pad, and a via fill. The insulating layer includes a via hole. The pad is formed in the insulating layer such that an intermediate portion thereof is exposed by the via hole. The pad includes a through hole formed in the intermediate portion. The via fill is formed in the via hole, configured to fill the through hole, and coupled to the intermediate portion.

公开(公告)号：US20200170110A1

公开(公告)日：2020-05-28

申请号：US16661051

申请日：2019-10-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seon-Ha KANG ,  Sa-Yong LEE ,  Mi-Sun HWANG ,  Ju-Ho KIM

IPC: H05K1/11 ,  H05K3/42

Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.

公开(公告)号：US20200154568A1

公开(公告)日：2020-05-14

申请号：US16674507

申请日：2019-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Byung-Duk NA ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Mi-Sun HWANG ,  Hee-Joon CHUN ,  Deok-Man KANG ,  Sun-A KIM

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.

公开(公告)号：US20180070458A1

公开(公告)日：2018-03-08

申请号：US15810343

申请日：2017-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok-Hwan AHN ,  Mi-Sun HWANG ,  Young-Gwan KO ,  Jong-Seok BAE ,  Myung-Sam KANG

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.