公开(公告)号：US20160192490A1

公开(公告)日：2016-06-30

申请号：US14966518

申请日：2015-12-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung-Sam KANG ,  Young-Gwan KO ,  Sang-Hoon KIM ,  Kang-Wook BONG ,  Hye-Won JUNG ,  Yong-Wan JI

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/428 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘层，其包括第一树脂层和第二树脂层，设置在绝缘层的上表面和下表面上的电路层，以及通孔，被配置为将形成在上表面上的电路层连接到电路层 形成在下表面上，第二树脂层通过第一树脂层从第一树脂层的上表面延伸到第一树脂层的下表面，以接触通孔的侧表面。

公开(公告)号：US20200178392A1

公开(公告)日：2020-06-04

申请号：US16663419

申请日：2019-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi-Sun HWANG ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Byung-Duk NA ,  Hee-Joon CHUN ,  Sun-A KIM ,  Deok-Man KANG

IPC: H05K1/11 ,  H05K3/00

Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.

公开(公告)号：US20200154568A1

公开(公告)日：2020-05-14

申请号：US16674507

申请日：2019-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Byung-Duk NA ,  Hye-Won JUNG ,  Jae-Sung SIM ,  Mi-Sun HWANG ,  Hee-Joon CHUN ,  Deok-Man KANG ,  Sun-A KIM

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.

公开(公告)号：US20160192491A1

公开(公告)日：2016-06-30

申请号：US14966442

申请日：2015-12-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung-Sam KANG ,  Young-Gwan KO ,  Sang-Hoon KIM ,  Kang-Wook BONG ,  Hye-Won JUNG ,  Yong-Wan JI

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K1/05 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/113 ,  H05K3/0023 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2203/0502 ,  H05K2203/0514

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括设置在基板的上表面上的第一电路层，设置在基板上的绝缘层和第一电路层，设置在绝缘层的上表面上的第二电路层，以及配置成 连接在第一电路层和第二电路层之间，并且通孔的下部与衬底的上表面接触。

公开(公告)号：US20160100485A1

公开(公告)日：2016-04-07

申请号：US14636076

申请日：2015-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye-Won JUNG ,  Myung-Sam KANG ,  Yong-Wan JI ,  Yong-Jin PARK ,  Young-Gwan KO ,  Kang-Wook BONG

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/115 ,  H05K1/0221 ,  H05K3/0094 ,  H05K3/0097 ,  H05K3/10 ,  H05K3/429 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2203/1536

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.

Abstract translation: 公开了印刷电路板和制造印刷电路板的方法，其包括：第一抗蚀剂层; 形成在第一抗蚀剂层上的第一电路; 绝缘膜，形成在所述第一抗蚀剂层上以覆盖所述第一电路的上表面和侧表面; 形成在所述绝缘膜上以与所述第一电路电连接的接地; 以及形成在绝缘膜上以覆盖地面的绝缘层。