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公开(公告)号：US10692638B2
公开(公告)日：2020-06-23
申请号：US15720463
申请日：2017-09-29
发明人： Jung Young Cho , Tai Yon Cho , Sung Nam Cho , Chang Hak Choi , San Kyeong
摘要： A magnetic sheet includes one or more magnetic layers formed of a metal ribbon, the metal ribbon includes fragments with metal oxide coating layers formed in spaces between the fragments.
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公开(公告)号：US20140370297A1
公开(公告)日：2014-12-18
申请号：US14041892
申请日：2013-09-30
发明人： Jun Young Kim , Sung Nam Cho , Young Kwan Seo
IPC分类号： H01B1/12
CPC分类号： H01B1/127 , Y10T428/31507 , Y10T428/31645 , Y10T428/31721 , Y10T428/31797 , Y10T428/3188 , Y10T428/31909 , Y10T428/31913 , Y10T428/31938
摘要： Disclosed herein is a conductive polymer composition capable of deteriorating water-absorption property and maintaining electrical conductivity by neutralizing polyethylenedioxythiophene/polystyrenesulfonate (PEDOT/PSS) with dicyclohexylmethylamine which is lipid-soluble tertiary amine, and a conductive film using the same.
摘要翻译： 本发明公开了能够通过用作为脂溶性叔胺的二环己基甲基胺中和聚亚乙基二氧噻吩/聚苯乙烯磺酸盐（PEDOT / PSS）和使用其的导电膜，能够降低吸水性和保持导电性的导电聚合物组合物。
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公开(公告)号：US11431107B2
公开(公告)日：2022-08-30
申请号：US16739177
申请日：2020-01-10
发明人： Ju Hyoung Park , Sung Yong An , Myeong Woo Han , Sung Nam Cho , Jae Yeong Kim
摘要： A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.
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公开(公告)号：US11223133B2
公开(公告)日：2022-01-11
申请号：US16802798
申请日：2020-02-27
发明人： Jae Yeong Kim , Chin Mo Kim , Ji Hyung Jung , Sung Nam Cho , Sung Yong An
摘要： A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
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公开(公告)号：US11223100B2
公开(公告)日：2022-01-11
申请号：US16732762
申请日：2020-01-02
发明人： Jae Yeong Kim , Sung Nam Cho , Sung Yong An , Ji Hyung Jung , Chin Mo Kim
摘要： A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
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公开(公告)号：US10938091B1
公开(公告)日：2021-03-02
申请号：US16743453
申请日：2020-01-15
发明人： Sung Nam Cho , Sung Yong An , Jae Yeong Kim , Ju Hyoung Park
摘要： A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
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公开(公告)号：US11652272B2
公开(公告)日：2023-05-16
申请号：US17499212
申请日：2021-10-12
发明人： Jae Yeong Kim , Sung Nam Cho , Sung Yong An , Ji Hyung Jung , Chin Mo Kim
CPC分类号： H01Q1/2283 , H01Q1/38 , H01Q1/48 , H01Q9/0457 , H01Q9/40 , H01Q21/065
摘要： A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
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公开(公告)号：US11621491B2
公开(公告)日：2023-04-04
申请号：US17405286
申请日：2021-09-01
发明人： Jae Yeong Kim , Chin Mo Kim , Ji Hyung Jung , Sung Nam Cho , Sung Yong An
摘要： A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
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公开(公告)号：US11233336B2
公开(公告)日：2022-01-25
申请号：US16670139
申请日：2019-10-31
发明人： Ju Hyoung Park , Kyu Bum Han , Jae Yeong Kim , Jeong Ki Ryoo , Sung Nam Cho , Sung Yong An
摘要： A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.
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公开(公告)号：US11069954B2
公开(公告)日：2021-07-20
申请号：US16788585
申请日：2020-02-12
发明人： Chin Mo Kim , Jae Yeong Kim , Sung Yong An , Sung Nam Cho , Ji Hyung Jung
摘要： A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
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