Electronic device having a plurality of stacked coil antennas

    公开(公告)号:US10965157B2

    公开(公告)日:2021-03-30

    申请号:US16527853

    申请日:2019-07-31

    Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface enclosing a space between the first surface and the second surface, a display exposed at least partially through the first surface, a first conductive coil positioned inside the housing, positioned above the display when viewed from above the second surface, and having an axis substantially perpendicular to the first direction or the second direction, and a second conductive coil and a third conductive coil positioned inside the housing, positioned above the first conductive coil when viewed from above the second surface, and having an axis substantially horizontal to the first direction or the second direction.

    IMAGE SENSOR
    5.
    发明公开
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20240079436A1

    公开(公告)日:2024-03-07

    申请号:US18388882

    申请日:2023-11-13

    CPC classification number: H01L27/14636 H01L27/1463 H01L27/14621

    Abstract: An image sensor including a substrate having first and second surfaces that are opposite to each other. The substrate includes unit pixel regions having photoelectric conversion regions. A semiconductor pattern is disposed in a first trench defined in the substrate and defines the unit pixel regions. The semiconductor pattern includes a first semiconductor pattern and a second semiconductor pattern disposed on the first semiconductor pattern. A back-side insulating layer covers the second surface of the substrate. The first semiconductor pattern includes a side portion extended along an inner side surface of the first trench and a bottom portion connected to the side portion and disposed closer to the second surface of the substrate than the side portion. The second semiconductor pattern extends toward the second surface of the substrate and is spaced apart from the back-side insulating layer with the bottom portion of the first semiconductor pattern interposed therebetween.

    Image sensor
    7.
    发明授权

    公开(公告)号:US12211880B2

    公开(公告)日:2025-01-28

    申请号:US18388882

    申请日:2023-11-13

    Abstract: An image sensor including a substrate having first and second surfaces that are opposite to each other. The substrate includes unit pixel regions having photoelectric conversion regions. A semiconductor pattern is disposed in a first trench defined in the substrate and defines the unit pixel regions. The semiconductor pattern includes a first semiconductor pattern and a second semiconductor pattern disposed on the first semiconductor pattern. A back-side insulating layer covers the second surface of the substrate. The first semiconductor pattern includes a side portion extended along an inner side surface of the first trench and a bottom portion connected to the side portion and disposed closer to the second surface of the substrate than the side portion. The second semiconductor pattern extends toward the second surface of the substrate and is spaced apart from the back-side insulating layer with the bottom portion of the first semiconductor pattern interposed therebetween.

    IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20230131769A1

    公开(公告)日:2023-04-27

    申请号:US17881862

    申请日:2022-08-05

    Abstract: An image sensor includes: a substrate including a plurality of pixel regions, a first surface and a second surface opposite to the first surface; and a deep device isolation pattern disposed between adjacent pixel regioas of the phirality of pixel regions and penetrating the substrate, wherein the deep deice isolation pattern includes: a semiconductor pattern extended from the second surface toward the first surface; and sidewall insulating patterns interposed between the semiconductor pattern and the substrate, wherein the semiconductor pattern includes sidewall portions and a filling portion, wherein the sidewall portions are provided adjacent to the sidewall insulating patterns, respectively, wherein the filling portion is provided between the sidewall portions, and wherein top surfaces of the sidewall portions are located at a height higher than a top surface of the filling portion,

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