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公开(公告)号:US20170194324A1
公开(公告)日:2017-07-06
申请号:US15461934
申请日:2017-03-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung-Gun You , Se-Wan PARK , Baik-Min SUNG , Bo-Cheol JEONG
IPC: H01L27/088 , H01L29/06 , H01L21/8234 , H01L29/78
CPC classification number: H01L27/0886 , H01L21/823431 , H01L21/823481 , H01L29/0649 , H01L29/7851 , H01L29/7853 , H01L29/7854
Abstract: Semiconductor devices are provided including a first fin-shaped pattern having first and second sidewalls facing one another and a field insulating film contacting at least a portion of the first fin-shaped pattern. The first fin-shaped pattern includes a lower portion of the first fin-shaped pattern contacting the field insulating film; an upper portion of the first fin-shaped pattern not contacting the field insulating film; a first boundary between the lower portion of the first fin-shaped pattern and the upper portion of the first fin-shaped pattern; and a first fin center line perpendicular to the first boundary and meeting the top of the upper portion of the first fin-shaped pattern. The first sidewall of the upper portion of the first fin-shaped pattern and the second sidewall of the upper portion of the first fin-shaped pattern are asymmetric with respect to the first fin center line.
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公开(公告)号:US20170110569A1
公开(公告)日:2017-04-20
申请号:US15292144
申请日:2016-10-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chong-Kwang CHANG , Young-Mook OH , Hak-Yoon AHN , Jung-Gun YOU , Gi-Gwan PARK , Baik-Min SUNG
IPC: H01L29/78 , H01L23/528 , H01L21/768 , H01L23/522
CPC classification number: H01L29/785 , H01L21/76807 , H01L21/76895 , H01L21/76897 , H01L23/485 , H01L23/5226 , H01L23/5283 , H01L23/53295 , H01L2029/7858
Abstract: A semiconductor device includes a gate structure on a substrate, a source/drain layer on a portion of the substrate adjacent the gate structure, a first contact plug contacting an upper surface of the source/drain layer, and a second contact plug contacting upper surfaces of the gate structure and the first contact plug. A bottom surface of the second contact plug has a first portion not contacting the upper surface of the first contact plug, and the first portion is higher than the upper surface of the gate structure.
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