公开(公告)号：US10829690B2

公开(公告)日：2020-11-10

申请号：US16502164

申请日：2019-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-yun Kim ,  Kenji Takai ,  Do-yoon Kim ,  Sang-kyun Kim ,  Bo-un Yoon

IPC: C09K13/00 ,  C09G1/06 ,  H01L21/321 ,  H01L29/66 ,  H01L21/28

Abstract: Disclosed is a slurry composition for chemical mechanical polishing (CMP) includes, as polishing particles, a complex compound of both fullerenol and alkylammonium hydroxide. The slurry composition, which exhibits excellent polishing properties, may be prepared at low cost in large quantities. Also disclosed is a method of preparing the slurry composition comprising obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene, removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles to the mixture, separating the hydrogen peroxide decomposition catalyst particles from the mixture by filtration, and adding a polishing additive to the mixture. Further disclosed is a method of fabricating a semiconductor device that includes providing a pattern defining a trench, forming a metal material film on the pattern to fill the trench, and performing CMP of the metal material film using the slurry composition.