公开(公告)号：US20170084986A1

公开(公告)日：2017-03-23

申请号：US15255568

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-Uk GANG ,  Byeonghwan YOUM ,  Kyung Bin KIM

IPC: H01Q1/24 ,  H01Q1/38 ,  H05K5/02

CPC classification number: H01Q1/243 ,  H01Q5/371 ,  H01Q9/42

Abstract: Disclosed is an electronic device having a housing and including an antenna device, and a method of manufacturing the housing. When the antenna device requiring a plating process is applied to the housing, the housing has an antenna and provides exterior deposition and visual enhancement to the electronic device.

公开(公告)号：US20170133748A1

公开(公告)日：2017-05-11

申请号：US15256926

申请日：2016-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Bin KIM ,  Jinu KIM ,  Byeonghwan YOUM ,  Gi-Uk GANG ,  Nak-Chung CHOI

IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/03

CPC classification number: H01Q1/243 ,  H01Q9/42 ,  H01Q21/28 ,  H05K5/0217 ,  H05K5/0247

Abstract: Various embodiments of the present disclosure may provide an electronic device that includes: a first cover configured to form a first surface of the electronic device; a second cover configured to form a second surface of the electronic device, the second cover being opposite to the first surface; a conductive sidewall configured to surround at least a part of a space formed between the first cover and the second cover; a conductive member located in the space and configured to integrally extend from the conductive sidewall, the conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a non-conductive member located in the space to make contact with the conductive member, the non-conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a conductive pattern disposed on the second surface of the non-conductive member and electrically connected to the conductive member; and a conductive structure disposed between the conductive pattern and the conductive member to electrically connect the conductive pattern to the conductive member. The non-conductive member may include a via hole that at least partially passes through the area between the first surface and the second surface thereof, and the conductive structure may include a first part having a first cross-sectional area and a second part having a second cross-sectional area that is larger than the first cross-sectional area, wherein at least a part of the conductive structure may be disposed within a through-hole of the non-conductive member, and the second part may be disposed closer to the second surface of the non-conductive member than the first part. Various other embodiments are possible.